Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)最新文献

A new concept for using of Al-sheet as integrated substrate for one or multichip module package 利用铝片作为单片或多片模组封装的集成基板的新概念

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670764

P. Philippov, R. Arnaudov, N. Yordanov, M. Gospodinova

{"title":"A new concept for using of Al-sheet as integrated substrate for one or multichip module package","authors":"P. Philippov, R. Arnaudov, N. Yordanov, M. Gospodinova","doi":"10.1109/ICMCM.1998.670764","DOIUrl":"https://doi.org/10.1109/ICMCM.1998.670764","url":null,"abstract":"In this paper, we present recent studies on the electromigration processes in Ag thin film parallel microstrip lines in MCM-D structures. The basic concept is application of accelerated local drop-tests of water solutions on the surfaces of two adjacent lines under a given voltage potential. These operational conditions are often met in the interconnection line buses placed in the top assembly level of multilayered hybrid structures. The subject of the investigations are MCM-Ds developed on an Al-sheet carrier with internal conducting and isolating layers, produced through unique selective electrochemical anodization of Al and Ta. This process technology also enables the creation of embedded R and C passive components based on TaO/sub x/N/sub 1-x/ and Ta/sub 2/O/sub 5/ (or Al/sub 2/O/sub 3/) respectively. We propose electrochemical deposition of Ag/Sb alloys on the surface of Al interconnection lines and contact pads to ease the bondability and solderability in chip mounting procedures. The artificially created silver migrated defects and partial shorts are investigated through the high frequency method of coupled transmission lines in order to eliminate the errors and insufficient validity of DC direct measurements.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124462971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Transcription solder bump technology using the evaporation method 采用蒸发法誊写焊料凹凸技术

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670800

K. Seyama, H. Yamamoto, K. Satou, H. Yoshimura, H. Ota, Y. Usui

引用次数: 2

AMI: A new thin film substrate technology AMI:一种新的薄膜衬底技术

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670762

D. Hurwitz, E. Igner, B. Yofis, D. Katz

{"title":"AMI: A new thin film substrate technology","authors":"D. Hurwitz, E. Igner, B. Yofis, D. Katz","doi":"10.1109/ICMCM.1998.670762","DOIUrl":"https://doi.org/10.1109/ICMCM.1998.670762","url":null,"abstract":"An advanced multilayer interconnect (AMI) technology has been developed. This technology offers high density and low cost multilayer substrates for use in build-up MCM-D/L layers and chip scale packages (CSPs). In the AMI manufacturing process, the multilayer is built up on a planarized substrate material, using nonphotosensitive benzocyclobutene (BCB) as an insulator, and micro-filled aluminum vias. Four major steps are involved in the AMI process: (1) aluminum deposition over a planarized base material; (2) selective conversion of the deposited aluminum oxide, thereby creating lines and via posts; (3) replacement of the previously formed aluminum oxide by BCB; (4) mechanical polishing of the coated BCB to expose the top surface of the aluminum via posts. Steps 1 to 4 are repeated until the required number of layers is achieved. A detailed description of the AMI process steps is given. The key processes of metal deposition, adhesion enhancement, anodization and mechanical polishing are discussed. Reliability test data, typical key features and the electrical performance of an AMI prototype are presented. Particularly noteworthy are the advantages offered by the AMI structure: low production cost and large area panel (LAP) processing capabilities; superior planarity provides higher production yield and facilitates flip chip attachment; high density interconnectivity through the use of stacked and padless via posts; outstanding thermal and electrical properties through the use of filled aluminum vias.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129839314","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Integrated passive components in MCM-Si technology and their applications in RF-systems MCM-Si技术中的集成无源元件及其在射频系统中的应用

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670790

J. Hartung

引用次数: 11

Microwave multichip modules using low cost microwave chip on flex packaging technology 微波多芯片模块采用低成本微波芯片上的柔性封装技术

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670791

M. McNulty, J. Schnell, D. Nixon

{"title":"Microwave multichip modules using low cost microwave chip on flex packaging technology","authors":"M. McNulty, J. Schnell, D. Nixon","doi":"10.1109/ICMCM.1998.670791","DOIUrl":"https://doi.org/10.1109/ICMCM.1998.670791","url":null,"abstract":"Microwave chip on flex (MCOF) is an innovative, low cost extension of Lockheed Martin's high density interconnect (HDI) technology. In MCOF technology, die are attached face down on an adhesive backed pre-patterned polyimide dielectric and then overmolded with an epoxy encapsulant. Laser drilled vias followed by multilayer thin film metallization complete the circuit. Significant cost and weight advantages are attained by replacing traditional module substrates with an epoxy encapsulant. Transmit/receive (T/R) modules, thousands of which may be used in a solid state phased array radar application, are particularly good candidates for this technology. This paper describes the use of MCOF technology to package T/R modules for solid state radar applications. An overview of the MCOF process is first presented, followed by a review of the design and fabrication considerations for MCOF multichip modules. Specific attention is focused on the unique packaging and electrical performance requirements of T/R modules and how these objectives are met by MCOF technology. Finally, reliability considerations for use in military applications are discussed. Potential MCOF failure mechanisms and the MCOF reliability plan are presented.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126450521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Study of RF flip-chip assembly with underfill epoxy 下填充环氧树脂的射频倒装芯片组装研究

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670754

W. Zhang, B. Su, Z. Feng, K. C. Gupta, Y.C. Lee

引用次数: 3

Replaceable chip module (RCM/sup TM/) 可更换芯片模块(RCM/sup TM/)

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670814

J. Rathburn

{"title":"Replaceable chip module (RCM/sup TM/)","authors":"J. Rathburn","doi":"10.1109/ICMCM.1998.670814","DOIUrl":"https://doi.org/10.1109/ICMCM.1998.670814","url":null,"abstract":"Gryphics, Inc. is developing a means of incorporating ICs into a very low cost replaceable chip module (RCM). This high density module accepts a wide variety of devices in many applications. Each device is interconnected by a very low inductance multi-mode compliance contact system, which is solderless and demateable. The loaded RCM can be used as a characterization, test, burn-in, and production system use interface, where all ICs or passive components remain unhandled, and in an actual use configuration. No additional test, burn-in or production socketing is required, with any faulty components removed and replaced without need for rework. Thermal management is also incorporated as required. A wide variety of configurations and interface formats are being developed, with applications including MCMs, memory modules, PCMCIA modules, connectors with integrated semiconductors, microprocessor/memory modules, sockets and interfaces, production level connectors, and multidirectional interconnects among others. The RCMs are low profile, high density packaged assemblies that can accept a mixture of typical packaged devices, discrete/passive devices, chip scale/flip chip devices, or bare die in some cases. Costly or low yield semiconductor devices are interconnected in a removable fashion via an organic, ceramic, or flex substrate without the temperatures required for solder flow. Simple removal and replacement of failed devices allows for great flexibility, upgrade options, and a reduction in the significance of known good die, with correlation between test and as-used performance.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129975031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Stress comparison of TBGA, MBGA, and ViperBGA/sup TM/ using the PAQC chip 使用PAQC芯片对TBGA、MBGA和ViperBGA/sup TM进行应力比较

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670815

T. Evans, W.T. Bright, E. A. Kenyon

引用次数: 3

Characterization and processing of low dielectric constant thick film substrates for MCM-C modules MCM-C模块低介电常数厚膜衬底的表征与加工

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670780

D. Kellerman, D. J. Nabatian, P. Bokalo, Fengmei He, L. Retherford, A. Elshabini, F. Barlow

引用次数: 0

MCM-L requirements for an automotive electronic control unit application MCM-L要求的汽车电子控制单元应用

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Pub Date : 1998-04-15 DOI: 10.1109/ICMCM.1998.670837

J. Joly, D. Lambert, J. Hunt

引用次数: 0