Replaceable chip module (RCM/sup TM/)

Abstract

Gryphics, Inc. is developing a means of incorporating ICs into a very low cost replaceable chip module (RCM). This high density module accepts a wide variety of devices in many applications. Each device is interconnected by a very low inductance multi-mode compliance contact system, which is solderless and demateable. The loaded RCM can be used as a characterization, test, burn-in, and production system use interface, where all ICs or passive components remain unhandled, and in an actual use configuration. No additional test, burn-in or production socketing is required, with any faulty components removed and replaced without need for rework. Thermal management is also incorporated as required. A wide variety of configurations and interface formats are being developed, with applications including MCMs, memory modules, PCMCIA modules, connectors with integrated semiconductors, microprocessor/memory modules, sockets and interfaces, production level connectors, and multidirectional interconnects among others. The RCMs are low profile, high density packaged assemblies that can accept a mixture of typical packaged devices, discrete/passive devices, chip scale/flip chip devices, or bare die in some cases. Costly or low yield semiconductor devices are interconnected in a removable fashion via an organic, ceramic, or flex substrate without the temperatures required for solder flow. Simple removal and replacement of failed devices allows for great flexibility, upgrade options, and a reduction in the significance of known good die, with correlation between test and as-used performance.