Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - 最新文献
Pub Date : 1998-04-15
DOI: 10.1109/ICMCM.1998.670764
P. Philippov, R. Arnaudov, N. Yordanov, M. Gospodinova
Pub Date : 1998-04-15
DOI: 10.1109/ICMCM.1998.670800
K. Seyama, H. Yamamoto, K. Satou, H. Yoshimura, H. Ota, Y. Usui
Pub Date : 1998-04-15
DOI: 10.1109/ICMCM.1998.670762
D. Hurwitz, E. Igner, B. Yofis, D. Katz
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