{"title":"使用PAQC芯片对TBGA、MBGA和ViperBGA/sup TM进行应力比较","authors":"T. Evans, W.T. Bright, E. A. Kenyon","doi":"10.1109/ICMCM.1998.670815","DOIUrl":null,"url":null,"abstract":"A strain gauge on the PAQC (package assembly qualification & characterization) chip is used to make a comparison of mechanical stress over temperature between three different package types. The tape-ball grid array (tapeBGA), metalBGA, and ViperBGA/sup TM/ are assembled and stress tested as part of an ongoing reliability evaluation. Stress resistor values are sampled and compared, before production lots of each type are put through qualification testing. After qualification tests are completed, stress resistor values are sampled again and compared to the original data.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"26 Pt 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Stress comparison of TBGA, MBGA, and ViperBGA/sup TM/ using the PAQC chip\",\"authors\":\"T. Evans, W.T. Bright, E. A. Kenyon\",\"doi\":\"10.1109/ICMCM.1998.670815\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A strain gauge on the PAQC (package assembly qualification & characterization) chip is used to make a comparison of mechanical stress over temperature between three different package types. The tape-ball grid array (tapeBGA), metalBGA, and ViperBGA/sup TM/ are assembled and stress tested as part of an ongoing reliability evaluation. Stress resistor values are sampled and compared, before production lots of each type are put through qualification testing. After qualification tests are completed, stress resistor values are sampled again and compared to the original data.\",\"PeriodicalId\":315799,\"journal\":{\"name\":\"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)\",\"volume\":\"26 Pt 6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1998.670815\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1998.670815","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Stress comparison of TBGA, MBGA, and ViperBGA/sup TM/ using the PAQC chip
A strain gauge on the PAQC (package assembly qualification & characterization) chip is used to make a comparison of mechanical stress over temperature between three different package types. The tape-ball grid array (tapeBGA), metalBGA, and ViperBGA/sup TM/ are assembled and stress tested as part of an ongoing reliability evaluation. Stress resistor values are sampled and compared, before production lots of each type are put through qualification testing. After qualification tests are completed, stress resistor values are sampled again and compared to the original data.
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