Characterization and processing of low dielectric constant thick film substrates for MCM-C modules

Abstract

The application of a new microsphere low K thick film material to large MCM-C substrates is discussed in this paper. Processing of large ceramic boards approximately 6.5/spl times/8.5 in/sup 2/ with 4 metal layers is described. Both screen printed and etched silver and gold metallizations are used for this work. The electrical, physical, and materials characterization of both silver and gold compatible multilayer low K dielectric material is detailed. High frequency characterization of the material is also discussed over a wide frequency bandwidth between 1-12 GHz.