MCM-D and direct module attach for RF applications

Abstract

Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. In this paper, an example is presented of a highly miniaturised VCO function for a 2.45 GHz wireless LAN radio system that illustrates the use of such component integration processes and packaging concepts in an RF application. An MCM-D substrate technology has been employed in this work for passive component integration and a packageless direct module attach (DMA) concept has been devised and implemented for module-to-next-level interconnection. The MCM-D technology employed is reviewed and the DMA concept introduced. The design, performance, thermal characteristics and reliability of the DMA technology are described. The application of the MCM-D and DMA technologies in a wireless LAN RF function is then presented.