U. Langenkamp, M. Menke, M. Plan, P. Runkel, M. Schu, B. Stumpf, R. Heimgartner, B. Schatzler, R. Gottinger
{"title":"A low-cost MCM implementation for 100-Hz TV up-conversion","authors":"U. Langenkamp, M. Menke, M. Plan, P. Runkel, M. Schu, B. Stumpf, R. Heimgartner, B. Schatzler, R. Gottinger","doi":"10.1109/ICMCM.1998.670838","DOIUrl":null,"url":null,"abstract":"A system-on-chip covering all 100 Hz TV digital signal processing functions has been implemented as a MCM in a P-MQFP-64 package. The design, architecture, test concept and special arrangement of two chips assembled together are presented. The yield improvement of the larger memory chip achieved by redundancy optimization has led to a profitable product with higher yield and lower costs than previous multi-package solutions. This development was based on state-of-the-art technology, using materials that were as standard as possible and included DFT (design for testability) right from the outset, i.e. sufficient flexibility to test every block of a multichip module. The time-to-market requirements were effectively satisfied by implementing the system as a MCM. The rough estimate made here shows that when it comes to implementing future high-performance on-chip systems with advanced logic and memory integration, the obvious choice is an emergent embedded DRAM technology.","PeriodicalId":315799,"journal":{"name":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1998.670838","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A system-on-chip covering all 100 Hz TV digital signal processing functions has been implemented as a MCM in a P-MQFP-64 package. The design, architecture, test concept and special arrangement of two chips assembled together are presented. The yield improvement of the larger memory chip achieved by redundancy optimization has led to a profitable product with higher yield and lower costs than previous multi-package solutions. This development was based on state-of-the-art technology, using materials that were as standard as possible and included DFT (design for testability) right from the outset, i.e. sufficient flexibility to test every block of a multichip module. The time-to-market requirements were effectively satisfied by implementing the system as a MCM. The rough estimate made here shows that when it comes to implementing future high-performance on-chip systems with advanced logic and memory integration, the obvious choice is an emergent embedded DRAM technology.