Journal of Electronics Manufacturing最新文献_第4页

DESIGN ISSUES ASSOCIATED WITH NEURAL NETWORK SYSTEMS APPLIED WITHIN THE ELECTRONICS MANUFACTURING DOMAIN 与电子制造领域应用的神经网络系统相关的设计问题

Journal of Electronics Manufacturing Pub Date : 2000-03-01 DOI: 10.1142/S0960313100000046

A. West, C. Hinde, C. Messom, R. Harrison, David J. Williams

{"title":"DESIGN ISSUES ASSOCIATED WITH NEURAL NETWORK SYSTEMS APPLIED WITHIN THE ELECTRONICS MANUFACTURING DOMAIN","authors":"A. West, C. Hinde, C. Messom, R. Harrison, David J. Williams","doi":"10.1142/S0960313100000046","DOIUrl":"https://doi.org/10.1142/S0960313100000046","url":null,"abstract":"Neural networks have been applied within manufacturing domains, in particular electronics industries, to address the inherent complexity, the large number of interacting process features and the lack of robust analytical models of real industrial processes. The ability of neural systems to provide nonlinear mappings between process features and desired outputs has been the major driving force behind implementations. One of the major issues limiting the widespread industrial uptake of neural systems is the lack of detailed understanding of their design, implementation and operation. In many cases, network topologies and training parameters are systematically varied until satisfactory convergence is achieved. There is little discussion of the rationale behind the adopted training methods. A review of research into the functions that can be readily represented by neural networks are presented in this paper. The application focus is the control and monitoring of a discrete manufacturing process that is part of the manufacturing cycle of mixed technology surface mount printed circuit boards. Detailed knowledge of the process operation and functionality that can be represented by simple network topologies have been combined to develop a structured, partially interconnected neural network that provides optimised convergence performance. A comparison of the designed solution with standard approaches to neural network implementation is given. It has been demonstrated that if there is sufficient confidence in the operation of the process, input feature interaction within the network can be constrained to produce a robust control and monitoring system.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131746557","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

HIGHLY ACCELERATED SOLDER JOINT RELIABILITY TEST USING A THERMO-MECHANICAL DEFLECTION SYSTEM (TMDS) 采用热机械偏转系统(tmds)的高加速焊点可靠性试验

Journal of Electronics Manufacturing Pub Date : 2000-03-01 DOI: 10.1142/S0960313100000058

H. Pang, K. H. Ang, X. Shi, Z. Wang

引用次数: 2

Single level integration packaging : Meeting the requirements of ultra high density and high frequency 单级集成封装:满足超高密度、高频率要求

Journal of Electronics Manufacturing Pub Date : 2000-03-01 DOI: 10.1142/S0960313100000034

Lirong Zheng, H. Tenhunen

引用次数: 1

DESIGN AND MANUFACTURING OF MICRO VIA-IN-PAD SUBSTRATES FOR SOLDER BUMPED FLIP CHIP APPLICATIONS 设计和制造用于焊接碰撞倒装芯片的微通孔衬底

Journal of Electronics Manufacturing Pub Date : 2000-03-01 DOI: 10.1142/S0960313100000101

J. Lau, Chris Chang, Ricky S. W. Lee, Tsung-yuan Chen, D. Cheng, T. Tseng, D. Lin

引用次数: 7

INTERDIGITATED CAPACITORS BY OFFSET LITHOGRAPHY 胶印式交叉数字化电容器

Journal of Electronics Manufacturing Pub Date : 2000-03-01 DOI: 10.1142/S096031310000006X

P. Harrey, P. Evans, B. Ramsey, D. Harrison

引用次数: 12

INTELLIGENT SIMULATION ENVIRONMENT FOR PRINTED CIRCUIT BOARD ASSEMBLY 印刷电路板装配智能仿真环境

Journal of Electronics Manufacturing Pub Date : 1999-12-01 DOI: 10.1142/S0960313199000222

S. A. Ali, Robert de Souza, Arun Kumar

引用次数: 3

THERMAL DESIGN OF HIGH POWER SEMICONDUCTOR PACKAGES FOR AIRCRAFT SYSTEMS 飞机系统高功率半导体封装的热设计

Journal of Electronics Manufacturing Pub Date : 1999-12-01 DOI: 10.1142/S0960313199000180

F. Sarvar, D. Whalley

{"title":"THERMAL DESIGN OF HIGH POWER SEMICONDUCTOR PACKAGES FOR AIRCRAFT SYSTEMS","authors":"F. Sarvar, D. Whalley","doi":"10.1142/S0960313199000180","DOIUrl":"https://doi.org/10.1142/S0960313199000180","url":null,"abstract":"Future aircraft containing a greater proportion of electrical systems will require more extensive use of power electronics, for which thermal management is a key issue. This paper will present an approach to semiconductor package design incorporating integrated air cooled heatsinks. The paper will show how simple models of the heat transfer from heatsink fins, which are based on well established empirical correlations, may be utilised in combination with simple models of the heat conduction from the semiconductor die through the multilayer package structure to the base of the fins. These models allow the generation of design curves which may be used to rapidly explore a wide range of design options before selecting potential designs for more detailed evaluation using 3-D FE analysis. This approach has been used to design a semiconductor package for a power converter where the semiconductor devices are switched at high frequency to ensure good input and output current waveforms. The power dissipated in the semiconductors, and therefore the heatsink weight however increases with the switching frequency, whereas the associated filtering components will be smaller and lighter at higher frequencies. The optimisation of the overall system weight therefore involves a trade-off between the heatsinking and filtering requirements rather than just determining the optimum heatsink design for a specific power dissipation.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133414839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

ON SOLVING SINGLE MACHINE OPTIMIZATION PROBLEMS IN ELECTRONICS ASSEMBLY 电子装配中单机优化问题的解决

Journal of Electronics Manufacturing Pub Date : 1999-12-01 DOI: 10.1142/S0960313199000179

G. Magyar, M. Johnsson, O. Nevalainen

引用次数: 35

DESIGN, MANUFACTURING, AND TESTING OF A NOVEL PLASTIC BALL GRID ARRAY PACKAGE 一种新型塑料球栅阵列封装的设计、制造和测试

Journal of Electronics Manufacturing Pub Date : 1999-12-01 DOI: 10.1142/S0960313199000209

J. Lau, Chris Chang, Tony Chen, Tsung-yuan Chen, T. Tseng, D. Cheng

引用次数: 4

ELECTROMAGNETIC WAVE TRANSMISSION THROUGH LOSSLESS ELECTRICALLY CONDUCTIVE ADHESIVE 电磁波通过无损导电胶粘剂传输

Journal of Electronics Manufacturing Pub Date : 1999-12-01 DOI: 10.1142/S0960313199000192

Y. Fu, Johan Liu, M. Willander

{"title":"ELECTROMAGNETIC WAVE TRANSMISSION THROUGH LOSSLESS ELECTRICALLY CONDUCTIVE ADHESIVE","authors":"Y. Fu, Johan Liu, M. Willander","doi":"10.1142/S0960313199000192","DOIUrl":"https://doi.org/10.1142/S0960313199000192","url":null,"abstract":"We report our theoretical study on the electric conduction and the electromagnetic wave transmission between the IC chip and the substrate. The IC chip and the substrate are connected electrically by upper and lower contact shoulders which are conductively connected through an anisotropically conductive adhesive (ACA). It has been concluded that following the increase of the frequency of the electromagnetic field, the transmission of the electromagnetic field shifts from the conducting medium (metal) to non-conducting medium (adhesive) due to the skin effect. The DC electric conduction of the ACA is limited by the sizes, geometric shapes as well as spatial positions of metal fillers in the ACA. By excluding energy dissipation processes (because of the short distance between the upper and the lower contacts), our theoretical simulation indicates that the transmission of high-frequency (above 1 GHz when discussing the conduction properties of metal fillers having radius of no less than 5 μm) electromagnetic wave through the ACA is almost independent of the metal fillers because of the displacement current in the non-conductive medium between the upper and lower contacts.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127458433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5