{"title":"单级集成封装:满足超高密度、高频率要求","authors":"Lirong Zheng, H. Tenhunen","doi":"10.1142/S0960313100000034","DOIUrl":null,"url":null,"abstract":"The traditional electronic packaging hierarchies present a bottleneck for increasing system speed and density. A revolutionary rethinking is therefore necessary which aims to integrate or eliminate the current packaging hierarchies towards single level hierarchy integration. In this paper, such a novel packaging scenario is introduced. Its technology concerns and electric performance are studied.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Single level integration packaging : Meeting the requirements of ultra high density and high frequency\",\"authors\":\"Lirong Zheng, H. Tenhunen\",\"doi\":\"10.1142/S0960313100000034\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The traditional electronic packaging hierarchies present a bottleneck for increasing system speed and density. A revolutionary rethinking is therefore necessary which aims to integrate or eliminate the current packaging hierarchies towards single level hierarchy integration. In this paper, such a novel packaging scenario is introduced. Its technology concerns and electric performance are studied.\",\"PeriodicalId\":309904,\"journal\":{\"name\":\"Journal of Electronics Manufacturing\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronics Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1142/S0960313100000034\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronics Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1142/S0960313100000034","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Single level integration packaging : Meeting the requirements of ultra high density and high frequency
The traditional electronic packaging hierarchies present a bottleneck for increasing system speed and density. A revolutionary rethinking is therefore necessary which aims to integrate or eliminate the current packaging hierarchies towards single level hierarchy integration. In this paper, such a novel packaging scenario is introduced. Its technology concerns and electric performance are studied.
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