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METHOD FOR FORMULATING PRODUCT END-OF-LIFE STRATEGIES FOR ELECTRONICS INDUSTRY 电子工业产品报废策略的制定方法
Journal of Electronics Manufacturing Pub Date : 2002-06-01 DOI: 10.1142/S0960313102000369
C. Rose, A. Stevels, K. Ishii
{"title":"METHOD FOR FORMULATING PRODUCT END-OF-LIFE STRATEGIES FOR ELECTRONICS INDUSTRY","authors":"C. Rose, A. Stevels, K. Ishii","doi":"10.1142/S0960313102000369","DOIUrl":"https://doi.org/10.1142/S0960313102000369","url":null,"abstract":"This paper describes the structured methodology for formulating end-of-life strategies, using specific examples from consumer electronics products. The End-of-Life Design Advisor (ELDA), a web based tool, was developed to determine what end-of-life strategy is possible according to the products' technical characteristics. The classification of end-of-life strategies is compared with current industry practice, in order to evaluate and validate the method. ELDA succeeded in classifying end-of-life strategies in agreement with industry best practices for 86% of the products. This ability to classify end-of-life strategies enables designers to redesign products that move to end-of-life strategies with lower environmental impact. This paper also presents preliminary work on the calculation of the environmental impact of the end-of-life strategies, through a model called End-of-Life Strategy Environmental Impact Model (ELSEIM). By understanding better the end-of-life strategy appropriate for the product, the research results can help designers develop appropriate (and profitable) end-of-life strategies for their unique position, systematically.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116339100","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 46
Demand-driven disassembly optimization for electronic products 需求驱动的电子产品拆解优化
Journal of Electronics Manufacturing Pub Date : 2002-06-01 DOI: 10.1142/S0960313102000436
A. Lambert, S. Gupta
{"title":"Demand-driven disassembly optimization for electronic products","authors":"A. Lambert, S. Gupta","doi":"10.1142/S0960313102000436","DOIUrl":"https://doi.org/10.1142/S0960313102000436","url":null,"abstract":"In this paper, we address the problem of demand driven disassembly used to determine the optimal lot-sizes of end-of-life (EOL) products to disassemble so as to fulfil the demand of various components from a mix of different product types that have a number of components and / or modules in common. We discuss two approaches, viz., (1) the disassembly graph approach that is based on the study of the disassembly of mechanical products and (2) the component-disassembly optimization model that focuses on parts recovery by applying the reverse bill of materials. Although elegant, the main disadvantages of these two approaches are redundancy and nonlinearity respectively. To overcome these disadvantages, we propose a new method that combines the advantages of both approaches without their disadvantages. This is called the tree network model, which is a linear description of the demand driven, multiple product problem that includes commonality and multiplicity. Because of its simple structure, it can also be applied in dynamic situations, which is useful in problems that are related to production planning and inventory control in reverse logistics.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127413750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 75
UNDERSTANDING FORECAST VARIABILITY IN CONTRACT ELECTRONICS MANUFACTURING 了解合同电子制造的预测变化
Journal of Electronics Manufacturing Pub Date : 2002-06-01 DOI: 10.1142/S0960313102000412
Valerie Tardif, Mikka Nielsen
{"title":"UNDERSTANDING FORECAST VARIABILITY IN CONTRACT ELECTRONICS MANUFACTURING","authors":"Valerie Tardif, Mikka Nielsen","doi":"10.1142/S0960313102000412","DOIUrl":"https://doi.org/10.1142/S0960313102000412","url":null,"abstract":"In the past few years, the electronics industry has undergone an explosion in new products and technologies. This fierce global competition has resulted in the decision by many companies to outsource manufacturing in order to concentrate on research and development, marketing, and sales. This has given rise to a number of companies who solely provide electronics manufacturing services. Exchange of information between product developers and contract manufacturers, especially information about product demand, is critical to the success of this business model. In this paper, we analyze forecast data obtained from a local contract manufacturer in order to better understand forecast variability and its reasons. We find that forecast variability tends to increase as the production period approaches, despite common belief that forecasts get better with time. We also discuss the impact that chronic material unavailability and product mix have on forecast variability. Finally, we see that unmet demand pushed in the next production period can distort forecasts and result in unrealistic expectations.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114994694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
THE INCLUSION OF FUTURE ARRIVALS AND DOWNSTREAM SETUPS INTO WAFER FABRICATION BATCH PROCESSING DECISIONS 将未来到货和下游设置纳入晶圆制造批量处理决策
Journal of Electronics Manufacturing Pub Date : 2002-06-01 DOI: 10.1142/S0960313102000370
L. Solomon, J. Fowler, M. Pfund, P. H. Jensen
{"title":"THE INCLUSION OF FUTURE ARRIVALS AND DOWNSTREAM SETUPS INTO WAFER FABRICATION BATCH PROCESSING DECISIONS","authors":"L. Solomon, J. Fowler, M. Pfund, P. H. Jensen","doi":"10.1142/S0960313102000370","DOIUrl":"https://doi.org/10.1142/S0960313102000370","url":null,"abstract":"This paper presents a new batch machine dispatching policy that incorporates knowledge about future arrivals and the status of critical machines in subsequent (downstream) processing into the batch processing decision process. The intent is to create a methodology that balances the time lots spend waiting at a batch machine with the time spent in setup, thus improving the overall cycle time. Using discrete-event simulation, this heuristic is compared to existing heuristics that do not consider downstream operations to evaluate their impact on the cycle time both for a small three-machine system and a semiconductor manufacturing facility model. The results showed considerable improvement in cycle times for the small three-machine system. Results for the semiconductor-manufacturing model with downstream batching indicate that the new heuristic is robust but produces results consistent with the current standard heuristic; however, with further modifications, this heuristic may be capable of producing significantly better results.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130875291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 36
A MULTI-CRITERIA DECISION MAKING APPROACH FOR DISASSEMBLY-TO-ORDER SYSTEMS 拆装有序系统的多准则决策方法
Journal of Electronics Manufacturing Pub Date : 2002-06-01 DOI: 10.1142/S0960313102000345
E. Kongar, S. Gupta
{"title":"A MULTI-CRITERIA DECISION MAKING APPROACH FOR DISASSEMBLY-TO-ORDER SYSTEMS","authors":"E. Kongar, S. Gupta","doi":"10.1142/S0960313102000345","DOIUrl":"https://doi.org/10.1142/S0960313102000345","url":null,"abstract":"In this paper, we present a multi-criteria optimization model of a disassembly-to-order system to determine the best combination of the number of each product type to be taken back at the end-of-life and disassembled to meet the demand for items and materials retrieved from them under a variety of physical, financial and environmental constrains so as to achieve the preemptive goals of maximum total profit, maximum sales from materials, minimum number of disposed items, minimum number of stored items, minimum cost of disposal and minimum cost of preparation, in that order. When solved, the model provides the number of reused, recycled, stored and disposed items as well as the values of a host of other performance measures. A case example is presented to illustrate the model's implementation.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127422310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 112
A MULTI-EXCHANGE NEIGHBORHOOD SEARCH HEURISTIC FOR AN INTEGRATED CLUSTERING AND MACHINE SETUP MODEL FOR PCB MANUFACTURING 基于多交换邻域搜索启发式的PCB制造集成聚类和机器设置模型
Journal of Electronics Manufacturing Pub Date : 2002-06-01 DOI: 10.1142/S0960313102000448
M. Magazine, G. Polak, D. Sharma
{"title":"A MULTI-EXCHANGE NEIGHBORHOOD SEARCH HEURISTIC FOR AN INTEGRATED CLUSTERING AND MACHINE SETUP MODEL FOR PCB MANUFACTURING","authors":"M. Magazine, G. Polak, D. Sharma","doi":"10.1142/S0960313102000448","DOIUrl":"https://doi.org/10.1142/S0960313102000448","url":null,"abstract":"In the manufacture of printed circuit boards, electronic components are attached to a blank board by one or more pick-and-place machines. Frequent machine setups, though time-consuming, can reduce overall processing time. We consider the Integrated Clustering and Machine Setup (ICMS) model, which incorporates this tradeoff between processing time and setup time and seeks to minimize the sum of the two. Solving this model to optimality is intractable for very large-scale instances. We show that ICMS is NP-hard and consequently propose and test a heuristic based on multi-exchange neighborhood search structures. Initial numerical results arevery encouraging.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131271124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Component to multi-track feeder assignment and board sequencing for printed circuit board assembly 印刷电路板组装的多轨道馈线分配和电路板排序
Journal of Electronics Manufacturing Pub Date : 2002-03-01 DOI: 10.1142/S0960313102000266
Yu-An Li
{"title":"Component to multi-track feeder assignment and board sequencing for printed circuit board assembly","authors":"Yu-An Li","doi":"10.1142/S0960313102000266","DOIUrl":"https://doi.org/10.1142/S0960313102000266","url":null,"abstract":"Proper planning of multi-track feeders in the printed circuit board (PCB) assembly can increase the capacity of surface mount machines and reduce feeder changeovers. This paper describes a methodology for developing a process plan to minimize the feeder setups in multi-track feeder systems. Two problems are investigated: component to multi-track feeder assignment and PCB sequencing. The assignment problem is formulated as a multi-dimension symmetric assignment problem with an integer-programming model. The objective is to maximize the total similarity of the component assignment. The PCB sequencing problem is solved in three stages: component and PCB grouping, intra- and inter-group PCB sequencing, and feeder setup planning. The interrelationship between the assignment and the sequencing problems is also investigated.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"130 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127599076","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
MODELING OF MATERIAL HANDLING HOIST OPERATIONS IN A PCB MANUFACTURING FACILITY PCB制造工厂物料搬运提升机操作的建模
Journal of Electronics Manufacturing Pub Date : 2002-03-01 DOI: 10.1142/S0960313102000229
R. Mak, S. Gupta, K. Lam
{"title":"MODELING OF MATERIAL HANDLING HOIST OPERATIONS IN A PCB MANUFACTURING FACILITY","authors":"R. Mak, S. Gupta, K. Lam","doi":"10.1142/S0960313102000229","DOIUrl":"https://doi.org/10.1142/S0960313102000229","url":null,"abstract":"This paper outlines a framework for flexible hoist scheduling that utilizes a knowledge-based simulation system to emulate multi-hoist operations in an electroplating line and derives hoist schedule to meet production demands. The selected hoist schedule is then used by the knowledge-based controller to control the material handling hoist operations in real-time. The paper describes the overall design of the knowledge-based simulator for material handling hoist operations that forms the fundamental part of the proposed framework. Most hoist schedules in industry are experimented on-line, which are costly and time consuming. The use of knowledge-based simulation will save both cost and time. The simulator aims at improving current manual approaches so that better schedules can be identified. We demonstrate the application of the simulator to bi-directional multi-hoist line configuration that is commonly found in industry today, where loading and unloading stations are on the same end of the line, and consider other more realistic system parameters than those considered in previous studies. Three new hoist scheduling heuristics are proposed and their performances are compared with four previously studied rules. To this end, we also study the effect of several system variables such as hoist speed and inter-hoist distance on productivity. The simulation models developed are based on data from actual multi-hoist electroplating lines within several PCB manufacturing facilities.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127757307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
OPTIMIZATION OF PCB COMPONENT PLACEMENT USING GENETIC ALGORITHMS 利用遗传算法优化PCB元件布局
Journal of Electronics Manufacturing Pub Date : 2002-03-01 DOI: 10.1142/S0960313102000230
K. Jeevan, A. Parthiban, K. N. Seetharamu, I. Azid, G. Quadir
{"title":"OPTIMIZATION OF PCB COMPONENT PLACEMENT USING GENETIC ALGORITHMS","authors":"K. Jeevan, A. Parthiban, K. N. Seetharamu, I. Azid, G. Quadir","doi":"10.1142/S0960313102000230","DOIUrl":"https://doi.org/10.1142/S0960313102000230","url":null,"abstract":"This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation for each board has to be minimized. In this paper, the component placement sequence problem is modeled as a Traveling Salesman Problem (TSP) and is optimized by Genetic Algorithms (GAs). In this study, components are placed on PCB where the process of pick-up and placement occurs starting from an empty multi-headed placement machine moving to pick up the components from the feeder magazine. The number of components to be picked and placed can range from a minimum of one to a maximum of four, depending on its contribution to minimize tour distance. The difference in size of components is handled by the tool change process, which brings the optimization problem closer to real machine situation. The paper suggests GA as a better alternative to other heuristic solution approaches such as Variable Neighborhood Search (VNS) and local optimum search. GAs are more promising as a global and robust method of solution and it permits a simpler mathematical model to solve a component assembly problem. The tool change factor, which was not incorporated in previous studies have been included in the present paper for the first time.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114935620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 27
SCHEDULING OF PRINTED WIRING BOARD ASSEMBLY IN SURFACE MOUNT TECHNOLOGY LINES 表面贴装生产线印刷线路板组装的调度
Journal of Electronics Manufacturing Pub Date : 2002-03-01 DOI: 10.1142/S096031310200028X
T. Sawik, A. Schaller, T. Tirpak
{"title":"SCHEDULING OF PRINTED WIRING BOARD ASSEMBLY IN SURFACE MOUNT TECHNOLOGY LINES","authors":"T. Sawik, A. Schaller, T. Tirpak","doi":"10.1142/S096031310200028X","DOIUrl":"https://doi.org/10.1142/S096031310200028X","url":null,"abstract":"The paper presents a new mathematical programming approach for scheduling of printed wiring board assembly in SMT (Surface Mount Technology) lines. Various configurations of SMT lines encountered in the electronics industry are described and compared. An SMT line consists of several processing stages in series, separated by finite intermediate buffers, where each stage has one or more identical parallel machines. A board which has completed processing on a machine may remain there and block the machine until a downstream machine becomes available for processing. The objective is to determine an assembly schedule for a mix of board types, so as to complete the boards in minimum time. New mixed integer programming formulations are presented for blocking scheduling of various configurations of SMT lines that are found in the electronics industry. The proposed models can be used for optimization of assembly schedules by using commercially available software for discrete programming. Numerical examples are provided to illustrate the proposed approach. The influence of process time variability and machine breakdowns on an SMT line's performance is discussed.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115595931","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
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