Journal of Electronics Manufacturing最新文献_第10页

COMPREHENSIVE REVIEW OF NATURAL AND MIXED CONVECTION HEAT TRANSFER MODELS FOR CIRCUIT BOARD ARRAYS 电路板阵列的自然对流和混合对流传热模型综述

Journal of Electronics Manufacturing Pub Date : 1997-06-01 DOI: 10.1142/S0960313197000105

P. Teertstra, J. Culham, M. Yovanovich

引用次数: 13

A comparative study of forced and natural convection flow in a channel with discrete heated modules in turbulent regime 紊流状态下具有离散加热模块的通道内强迫对流与自然对流的比较研究

Journal of Electronics Manufacturing Pub Date : 1997-06-01 DOI: 10.1142/S0960313197000129

P. Deb, B. Basu, P. Majumdar

引用次数: 1

ON IMPROVING THE PERFORMANCE OF HARD DISK DRIVE FINAL ASSEMBLY VIA KNOWLEDGE INTENSIVE SIMULATION 基于知识密集型仿真的硬盘总装性能改进研究

Journal of Electronics Manufacturing Pub Date : 1997-06-01 DOI: 10.1142/S0960313197000142

Zhenying Zhao, Robert de Souza, Boon Khai. Koh

引用次数: 7

APPLICATION OF DIELECTRIC BINARY MIXTURES IN ELECTRONIC COOLING — NUCLEATE POOL BOILING REGIME 介电二元混合物在电子冷却-核池沸腾状态中的应用

Journal of Electronics Manufacturing Pub Date : 1997-06-01 DOI: 10.1142/S0960313197000117

T. Lee

{"title":"APPLICATION OF DIELECTRIC BINARY MIXTURES IN ELECTRONIC COOLING — NUCLEATE POOL BOILING REGIME","authors":"T. Lee","doi":"10.1142/S0960313197000117","DOIUrl":"https://doi.org/10.1142/S0960313197000117","url":null,"abstract":"This paper presents experimental results on nucleate pool boiling in dielectric mixtures. A silicon thermal test chip was immersed in a pool filled with perfluoropolyether binary mixtures. Two pure liquids, D80 and HT110, were mixed by volume as 0%, 20%, 50%, 80%, and 100%. All experiments were performed under 50°C subcooling at one atmospheric pressure. The results indicated that nucleate boiling curves were close to each other among pure liquids and mixtures. As more less-volatile liquid (HT110) was added, the mixture boiling curve shifted to the left and merged with that of the pure liquids. The boiling heat transfer coefficient increased linearly with rising heat flux. At all heat flux levels, the boiling heat transfer coefficient decreased as more less-volatile liquid was added and reached a minimum value at the 20/80% mixture of D80/HT110. The perfluoropolyether binary mixtures showed deterioration in heat transfer coefficient similar to the hydrocarbon mixtures. The measured values were always less than the ideal heat transfer coefficients obtained from a linear interpolation of values corresponding to the single components. The degree of degradation in heat transfer coefficient decreased as the heat flux increased for a given composition. The maximum heat transfer degradation did not occur at the same liquid composition for different heat flux levels: it occurred at the 50/50% mixture for two lower heat fluxes, and at the 20/80% mixture of D80/HT110 for two higher heat fluxes. Prediction of vapor mole fraction was also pursued. The results indicated that the maximum mole fraction difference between vapor and liquid phases existed at the 50/50% mixture. This particular composition did not always reflect the occurrence of the maximum heat transfer degradation, as it was reported in the hydrocarbon mixtures. Experimental data were tested with two empirical correlations with good agreement.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"07 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128994805","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY 一种新型的柯式光刻电路制造技术

Journal of Electronics Manufacturing Pub Date : 1997-03-01 DOI: 10.1142/S0960313197000075

B. Ramsey, P. Evans, D. Harrison

引用次数: 36

REWORK OF BGA COMPONENTS bga组件返工

Journal of Electronics Manufacturing Pub Date : 1997-03-01 DOI: 10.1142/S0960313197000051

C. Chung, K. Srihari, A. Primavera

{"title":"REWORK OF BGA COMPONENTS","authors":"C. Chung, K. Srihari, A. Primavera","doi":"10.1142/S0960313197000051","DOIUrl":"https://doi.org/10.1142/S0960313197000051","url":null,"abstract":"Area array packages are being increasingly used in the surface mount printed circuit board assembly domain due to their unique characteristics and high process yields. Several researchers have indicated that the process defects associated with the ball grid array components on printed circuit board assemblies are dramatically lower than those experienced with traditional leaded components. However, there are a number of other reasons to remove and replace components including package defects, engineering changes that are required after a number of components have been assembled, device or system upgrades, misregistration, wrong component orientation, etc. The rework of ball grid array components is a challenging task since the solder joints are hidden from view and cannot be readily accessed. Traditional approaches to rework that are applied to peripheral leaded or leadless components might not be applicable to ball grid array components. This paper provides a detailed discussion of the rework process for ball grid arrays. Topics that are addressed include the characterization of the rework system, nozzle design, the component removal process, the need for site redressing and the technique to be used, solder and flux application, and the component replacement process. A comprehensive set of process-related recommendations is provided for the rework of ball grid arrays.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133598441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS 复杂零件自然静息方面的分析

Journal of Electronics Manufacturing Pub Date : 1997-03-01 DOI: 10.1142/S0960313197000038

B. Ngoi, L. Lim, J. T. Ee

引用次数: 0

IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE 用热级环境扫描电子显微镜原位研究回流过程中锡膏的行为

Journal of Electronics Manufacturing Pub Date : 1997-03-01 DOI: 10.1142/S096031319700004X

M. Natishan, J. C. Powell, K. Beatty

引用次数: 1

ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY 电子工业的环境问题和回收/拆卸工作

Journal of Electronics Manufacturing Pub Date : 1997-03-01 DOI: 10.1142/S0960313197000026

Leanne K. Moyer, S. Gupta

引用次数: 168

TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY 电子和光子学的技术趋势，它们的建模和对制造和装配的影响

Journal of Electronics Manufacturing Pub Date : 1997-03-01 DOI: 10.1142/S0960313197000087

David J. Williams, P. J. Palmer, T. Edwards

引用次数: 5