利用遗传算法优化PCB元件布局

K. Jeevan, A. Parthiban, K. N. Seetharamu, I. Azid, G. Quadir
{"title":"利用遗传算法优化PCB元件布局","authors":"K. Jeevan, A. Parthiban, K. N. Seetharamu, I. Azid, G. Quadir","doi":"10.1142/S0960313102000230","DOIUrl":null,"url":null,"abstract":"This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation for each board has to be minimized. In this paper, the component placement sequence problem is modeled as a Traveling Salesman Problem (TSP) and is optimized by Genetic Algorithms (GAs). In this study, components are placed on PCB where the process of pick-up and placement occurs starting from an empty multi-headed placement machine moving to pick up the components from the feeder magazine. The number of components to be picked and placed can range from a minimum of one to a maximum of four, depending on its contribution to minimize tour distance. The difference in size of components is handled by the tool change process, which brings the optimization problem closer to real machine situation. The paper suggests GA as a better alternative to other heuristic solution approaches such as Variable Neighborhood Search (VNS) and local optimum search. GAs are more promising as a global and robust method of solution and it permits a simpler mathematical model to solve a component assembly problem. The tool change factor, which was not incorporated in previous studies have been included in the present paper for the first time.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"27","resultStr":"{\"title\":\"OPTIMIZATION OF PCB COMPONENT PLACEMENT USING GENETIC ALGORITHMS\",\"authors\":\"K. Jeevan, A. Parthiban, K. N. Seetharamu, I. Azid, G. Quadir\",\"doi\":\"10.1142/S0960313102000230\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation for each board has to be minimized. In this paper, the component placement sequence problem is modeled as a Traveling Salesman Problem (TSP) and is optimized by Genetic Algorithms (GAs). In this study, components are placed on PCB where the process of pick-up and placement occurs starting from an empty multi-headed placement machine moving to pick up the components from the feeder magazine. The number of components to be picked and placed can range from a minimum of one to a maximum of four, depending on its contribution to minimize tour distance. The difference in size of components is handled by the tool change process, which brings the optimization problem closer to real machine situation. The paper suggests GA as a better alternative to other heuristic solution approaches such as Variable Neighborhood Search (VNS) and local optimum search. GAs are more promising as a global and robust method of solution and it permits a simpler mathematical model to solve a component assembly problem. The tool change factor, which was not incorporated in previous studies have been included in the present paper for the first time.\",\"PeriodicalId\":309904,\"journal\":{\"name\":\"Journal of Electronics Manufacturing\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"27\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronics Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1142/S0960313102000230\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronics Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1142/S0960313102000230","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 27

摘要

本文主要研究印制电路板(PCB)自动化装配中所面临的优化问题。为了优化这些自动化机器的吞吐率,每个板的取放操作所花费的时间必须最小化。本文将零件放置顺序问题建模为一个旅行商问题(TSP),并利用遗传算法(GAs)进行优化。在本研究中,组件被放置在PCB上,其中拾取和放置过程从一个空的多头贴片机移动到从馈线杂志中拾取组件开始。要挑选和放置的组件的数量可以从最少一个到最多四个不等,这取决于它对最小化旅行距离的贡献。通过换刀过程处理零件尺寸的差异,使优化问题更接近实际机床情况。本文认为遗传算法是一种较好的替代其他启发式求解方法,如可变邻域搜索和局部最优搜索。GAs作为一种全局的、鲁棒的求解方法更有前景,它允许一个更简单的数学模型来求解组件装配问题。以前的研究中没有纳入工具变化因素,本文首次纳入。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
OPTIMIZATION OF PCB COMPONENT PLACEMENT USING GENETIC ALGORITHMS
This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation for each board has to be minimized. In this paper, the component placement sequence problem is modeled as a Traveling Salesman Problem (TSP) and is optimized by Genetic Algorithms (GAs). In this study, components are placed on PCB where the process of pick-up and placement occurs starting from an empty multi-headed placement machine moving to pick up the components from the feeder magazine. The number of components to be picked and placed can range from a minimum of one to a maximum of four, depending on its contribution to minimize tour distance. The difference in size of components is handled by the tool change process, which brings the optimization problem closer to real machine situation. The paper suggests GA as a better alternative to other heuristic solution approaches such as Variable Neighborhood Search (VNS) and local optimum search. GAs are more promising as a global and robust method of solution and it permits a simpler mathematical model to solve a component assembly problem. The tool change factor, which was not incorporated in previous studies have been included in the present paper for the first time.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信