ELECTROMAGNETIC WAVE TRANSMISSION THROUGH LOSSLESS ELECTRICALLY CONDUCTIVE ADHESIVE

Y. Fu, Johan Liu, M. Willander
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引用次数: 5

Abstract

We report our theoretical study on the electric conduction and the electromagnetic wave transmission between the IC chip and the substrate. The IC chip and the substrate are connected electrically by upper and lower contact shoulders which are conductively connected through an anisotropically conductive adhesive (ACA). It has been concluded that following the increase of the frequency of the electromagnetic field, the transmission of the electromagnetic field shifts from the conducting medium (metal) to non-conducting medium (adhesive) due to the skin effect. The DC electric conduction of the ACA is limited by the sizes, geometric shapes as well as spatial positions of metal fillers in the ACA. By excluding energy dissipation processes (because of the short distance between the upper and the lower contacts), our theoretical simulation indicates that the transmission of high-frequency (above 1 GHz when discussing the conduction properties of metal fillers having radius of no less than 5 μm) electromagnetic wave through the ACA is almost independent of the metal fillers because of the displacement current in the non-conductive medium between the upper and lower contacts.
电磁波通过无损导电胶粘剂传输
本文报道了集成电路芯片与衬底之间的导电和电磁波传输的理论研究。所述IC芯片和所述基板通过通过各向异性导电胶粘剂(ACA)导电连接的上下接触肩电连接。由此得出结论:随着电磁场频率的增加,由于趋肤效应,电磁场的传输从导电介质(金属)向非导电介质(粘合剂)转移。金属填充材料的尺寸、几何形状和空间位置限制了金属填充材料的直流导电性。通过排除能量耗散过程(由于上下触点之间的距离较短),我们的理论模拟表明,由于上下触点之间的非导电介质中的位移电流,高频(在讨论半径不小于5 μm的金属填料的传导特性时,频率在1 GHz以上)电磁波通过ACA的传输几乎与金属填料无关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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