{"title":"胶印式交叉数字化电容器","authors":"P. Harrey, P. Evans, B. Ramsey, D. Harrison","doi":"10.1142/S096031310000006X","DOIUrl":null,"url":null,"abstract":"This paper reports on an initial investigation into interdigitated capacitors manufactured via the offset lithographic printing process. Results taken from print-trials reveal the relationship between electrode geometry and capacitance. The paper also identifies a relationship between the substrate characteristics and the behaviour of the capacitive structures. This work is in support of a low cost and low environmental impact approach to circuit board manufacture.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"104 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"INTERDIGITATED CAPACITORS BY OFFSET LITHOGRAPHY\",\"authors\":\"P. Harrey, P. Evans, B. Ramsey, D. Harrison\",\"doi\":\"10.1142/S096031310000006X\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports on an initial investigation into interdigitated capacitors manufactured via the offset lithographic printing process. Results taken from print-trials reveal the relationship between electrode geometry and capacitance. The paper also identifies a relationship between the substrate characteristics and the behaviour of the capacitive structures. This work is in support of a low cost and low environmental impact approach to circuit board manufacture.\",\"PeriodicalId\":309904,\"journal\":{\"name\":\"Journal of Electronics Manufacturing\",\"volume\":\"104 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronics Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1142/S096031310000006X\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronics Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1142/S096031310000006X","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper reports on an initial investigation into interdigitated capacitors manufactured via the offset lithographic printing process. Results taken from print-trials reveal the relationship between electrode geometry and capacitance. The paper also identifies a relationship between the substrate characteristics and the behaviour of the capacitive structures. This work is in support of a low cost and low environmental impact approach to circuit board manufacture.
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