Journal of Electronics Manufacturing最新文献_第5页

PROPERTIES OF CONDUCTIVE ADHESIVES BASED ON DIFFERENT CURING AGENTS 基于不同固化剂的导电胶粘剂的性能

Journal of Electronics Manufacturing Pub Date : 1999-12-01 DOI: 10.1142/S0960313199000167

D. Lu, D. Wong, C. Wong

{"title":"PROPERTIES OF CONDUCTIVE ADHESIVES BASED ON DIFFERENT CURING AGENTS","authors":"D. Lu, D. Wong, C. Wong","doi":"10.1142/S0960313199000167","DOIUrl":"https://doi.org/10.1142/S0960313199000167","url":null,"abstract":"Electrically conductive adhesives (ECAs) are an environmentally friendly alternative for traditional tin/lead (Sn/Pb) solders. As a new technology, conductive adhesive technology still has many concerns and limitations. In order that conductive adhesive technology achieves universal acceptance, ECAs with better properties must be developed. ECAs consist of a polymeric matrix and a conductive filler. Compositions of the polymeric matrix play a very important role in determining the overall properties of ECAs. The objective of this study is to investigate the effects of different curing agents on the properties, especially contact resistance of conductive adhesives. Five polymeric matrix formulations are prepared by mixing five different curing agents, selected from different categories, with an epoxy resin. Using these polymeric matrix formulations, five ECAs are formulated. The properties of these ECAs studied include: curing profile, glass transition temperature (Tg), coefficient of thermal expansion (CTE), moisture absorption, adhesion strength, and shifts of contact resistance of these ECAs on non-noble metals such as tin, tin/lead, and copper, during elevated temperature and humidity aging. Also, a corrosion inhibitor is used to stabilize contact resistance of these ECAs on Sn/Pb. It is found that (1) the curing agents do affect the properties including contact resistance of ECAs and (2) the corrosion inhibitor is effective to stabilize contact resistance on Sn/Pb in all of the five ECA formulations.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132006296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

ASSEMBLY OF LARGE PBGAS ON PRINTED CIRCUIT BOARD WITH LARGE PQFPS DIRECTLY ON THE OPPOSITE SIDE 在印刷电路板上组装大的pbgas，大的PQFPS直接在对面

Journal of Electronics Manufacturing Pub Date : 1999-12-01 DOI: 10.1142/S0960313199000210

J. Lau, S. Lee, H. Chao

引用次数: 1

EVALUATION OF PLASMA TREATED HASL FINISH PCBs USING DCA MEASUREMENTS 用DCA测量评价等离子体处理的HASL光洁度pcb

Journal of Electronics Manufacturing Pub Date : 1999-09-01 DOI: 10.1142/S0960313199000155

G. Takyi, Nduka Nnamdi (Ndy) Ekere, K. Snowdon, C. G. Tanner

{"title":"EVALUATION OF PLASMA TREATED HASL FINISH PCBs USING DCA MEASUREMENTS","authors":"G. Takyi, Nduka Nnamdi (Ndy) Ekere, K. Snowdon, C. G. Tanner","doi":"10.1142/S0960313199000155","DOIUrl":"https://doi.org/10.1142/S0960313199000155","url":null,"abstract":"The use of plasma as a method of preparing PCBs and components prior to soldering is being investigated by the electronics industry as an alternative method to the conventional flux application. High surface energy is a requirement for improved wettability and good solderability. The surface energy of a solid is an important quantity which cannot be obtained directly by measurement. It can be obtained by contact angle measurements using probe liquids. In this paper, the methodology of dynamic contact angle (DCA) analysis is described and demonstrated for the assessment of the removal of organic contaminants from hot air solder levelled (HASL) finish PCBs by plasma cleaning. The DCA data was compared with Auger surface analysis results and SEM micrographs in order to obtain a complete profile of the surface in terms of the level of cleanliness. In the study, PCB samples were plasma treated under different plasma conditions using Xe/O2/Ne and Xe/O2/Ar gas combinations. The DCA results show a substantial decrease in advancing contact angles between the control and plasma treated samples. This indicates an increase in both surface energy and wettability which is confirmed by the lower carbon (organic contamination) levels in the Auger results. SEM micrographs of as-received plasma treated and untreated samples show a cleaner (wettable) surface in the case of the plasma treated sample and a poor (non-wettable) surface for the untreated sample. The results indicate that plasma treated HASL finish PCBs using Xe/O2/Ne gas mixtures can reduce organic contaminants to levels that will promote fluxless soldering.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125472029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

MODELS TO ESTIMATE PRINTED CIRCUIT BOARD FABRICATION YIELD DURING THE DESIGN STAGE 在设计阶段估计印刷电路板制造成品率的模型

Journal of Electronics Manufacturing Pub Date : 1999-09-01 DOI: 10.1142/S0960313199000118

R. Giachetti

引用次数: 5

PROPERTIES OF CONDUCTIVE ADHESIVES BASED ON ANHYDRIDE-CURED EPOXY SYSTEMS 基于酸酐固化环氧体系的导电胶粘剂的性能

Journal of Electronics Manufacturing Pub Date : 1999-09-01 DOI: 10.1142/S0960313199000143

D. Lu, C. Wong

{"title":"PROPERTIES OF CONDUCTIVE ADHESIVES BASED ON ANHYDRIDE-CURED EPOXY SYSTEMS","authors":"D. Lu, C. Wong","doi":"10.1142/S0960313199000143","DOIUrl":"https://doi.org/10.1142/S0960313199000143","url":null,"abstract":"Recently, isotropic conductive adhesives (ICAs) have been identified as a potential alternative for lead-containing solders in surface mount technology (SMT) applications. However, current commercial ICAs have some reliability issues that seriously limit their universal acceptance in electronics packaging areas. One of the critical reliability issues is that contact resistance between the ICAs and non-noble metals increases dramatically particularly during elevated temperature and humidity aging. The objective of this study is to investigate the contact resistance behaviors of a class of conductive adhesives, which are based on anhydride-cured epoxy systems, in elevated temperature and humidity environments. Cure profiles, moisture pickup, and shifts of contact resistance of the ICAs on different non-noble metals, such as tin (Sn), tin/lead (Sn/Pb), and copper (Cu), during aging are investigated. It is found that (1) this class of ICAs shows low moisture absorption; (2) the contact resistance of the ICAs on Sn and Sn/Pb decreases first and then increases slowly during 85°C/85% relative humidity (RH) aging; and (3) the contact resistance of the ICAs on Cu remains almost constant after the initial decrease during aging. In addition, the reasons for the contact resistance decrease are studied. Experimental results indicate that the initial contact resistance decrease is probably due to the removal of the insulating organic lubricant layer on silver (Ag) flakes or/and the removal of metal oxide layer on the non-noble metal surfaces by the acid, which is formed after the moisture reacts with the anhydride. From this study, it can be concluded that ICAs based on anhydride cured epoxy systems are promising formulations for surface mount technology applications.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125925420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

PRINTED CIRCUIT BOARD MANUFACTURING AND TESTING OF RIMM 印刷电路板的制造和测试

Journal of Electronics Manufacturing Pub Date : 1999-09-01 DOI: 10.1142/S0960313199000131

J. Lau, Chris Chang, Maurice Lee, D. Cheng, T. Tseng

引用次数: 1

CONTROL OF INCIPIENCE HYSTERESIS EFFECTS IN LIQUID COOLED ELECTRONICS HEAT SINKS 液冷电子散热器初期迟滞效应的控制

Journal of Electronics Manufacturing Pub Date : 1999-06-01 DOI: 10.1142/S0960313199000106

S. Bhavnani, S. E. Balch, R. Jaeger

{"title":"CONTROL OF INCIPIENCE HYSTERESIS EFFECTS IN LIQUID COOLED ELECTRONICS HEAT SINKS","authors":"S. Bhavnani, S. E. Balch, R. Jaeger","doi":"10.1142/S0960313199000106","DOIUrl":"https://doi.org/10.1142/S0960313199000106","url":null,"abstract":"Although air cooling continues to be the primary cooling technique for electronics, increases in chip density and power dissipation drive the need to study techniques such as liquid immersion cooling. This paper describes a saturated pool boiling study of interactions between different heat sources, located in close proximity so as to simulate neighboring ICs on a vertically oriented silicon multichip module, immersed in FC-72. The heat sinks tested consisted of re-entrant cavities etched in silicon to enhance thermal performance, while the heat sources were in the form of serpentine thin film heaters. The benchmark case to which all multiple heater tests were compared was the isolated central heater case with no heat dissipating neighbors. With just this heat source activated, the usual boiling incipience temperature hysteresis was experienced during the first increasing heat cycle. During the second cycle of increasing heat flux, this hysteresis all but disappeared, proving the efficacy of re-entrant cavities in trapping vapor, as long as the pool remained saturated. The presence of a neighboring heat source located below the test heater, dramatically improves the thermal performance, virtually eliminating hysteresis effects altogether.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123179348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

THERMAL STRATEGY FOR MODELING THE WIREBONDED PBGA PACKAGES 线结pbga封装建模的热策略

Journal of Electronics Manufacturing Pub Date : 1999-06-01 DOI: 10.1142/S0960313199000052

V. Chiriac, T. Lee

引用次数: 9

INVESTIGATIVE STUDY OF MANIFOLD MICROCHANNEL HEAT SINKS FOR ELECTRONIC COOLING DESIGN 用于电子冷却设计的多种微通道散热器的研究

Journal of Electronics Manufacturing Pub Date : 1999-06-01 DOI: 10.1142/S0960313199000088

E. Ng, S. T. Poh

引用次数: 23

THERMAL WAKE EFFECTS IN PRINTED CIRCUIT BOARDS 印刷电路板中的热尾流效应

Journal of Electronics Manufacturing Pub Date : 1999-06-01 DOI: 10.1142/S0960313199000039

J. Culham, P. Teertstra, M. Yovanovich

引用次数: 6