J. Lau, Chris Chang, Maurice Lee, D. Cheng, T. Tseng
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PRINTED CIRCUIT BOARD MANUFACTURING AND TESTING OF RIMM
The manufacturing process of printed circuit board (PCB) for the Rambus™-in-line memory module (RIMM™) is presented in this study. Emphasis is placed on the key process steps and the important parameters of each step. Cross sections of the PCB are examined for a better understanding of the 8-layer structure. Electrical performances such as the controlled impedance, propagation delay, crosstalk, and attenuation of the PCB are measured by the time domain reflectometer (TDR). The results are compared against the specifications.
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