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Journal of Electronics Manufacturing最新文献

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TURBULENT FLUID FLOWS AND HEAT TRANSFER CHARACTERISTICS IN FLOW CHANNELS WITH DISTRIBUTED CHIP MODULES 分布式芯片流道内的湍流流动及换热特性
Journal of Electronics Manufacturing Pub Date : 1999-06-01 DOI: 10.1142/S0960313199000040
P. Deb, P. Majumdar
{"title":"TURBULENT FLUID FLOWS AND HEAT TRANSFER CHARACTERISTICS IN FLOW CHANNELS WITH DISTRIBUTED CHIP MODULES","authors":"P. Deb, P. Majumdar","doi":"10.1142/S0960313199000040","DOIUrl":"https://doi.org/10.1142/S0960313199000040","url":null,"abstract":"A study is carried out to investigate the characteristics of turbulent fluid flow and heat transfer in the entrance region of a flow channel containing heat-generating modules of different sizes and distributions. The flow is described by Reynolds averaged Navier–Stokes equations and k-e model with wall function treatment. The prediction for flow and heat transfer characteristics has been made and compared with published experimental results. The computational results showed good agreement for performance parameters such as Nusselt numbers and Coefficient of pressure with experiments. The investigation is performed for Reynolds number values of 5000 and 15,000, and for two different geometrical configurations. Flow and heat transfer characteristics with varying parameters are also discussed.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114795833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
NUMERICAL SIMULATION OF FLOW AND CONJUGATE HEAT TRANSFER IN A MICROCHANNEL FOR ELECTRONICS COOLING 电子冷却微通道内流动与共轭传热的数值模拟
Journal of Electronics Manufacturing Pub Date : 1999-06-01 DOI: 10.1142/S0960313199000076
E. Ng, C. Tso, Z. Wen, K. F. Choo
{"title":"NUMERICAL SIMULATION OF FLOW AND CONJUGATE HEAT TRANSFER IN A MICROCHANNEL FOR ELECTRONICS COOLING","authors":"E. Ng, C. Tso, Z. Wen, K. F. Choo","doi":"10.1142/S0960313199000076","DOIUrl":"https://doi.org/10.1142/S0960313199000076","url":null,"abstract":"Microchannel heat sinks are minute flow channels fabricated onto the back of the thin silicon chip substrate with hydraulic diameter ranging from 10 μm to 103 μm. These heat sinks are characterized by extremely high surface area per unit volume of working fluid and low thermal resistance. This paper documents the modeling methodologies and the results of the numerical investigation on a laminar forced convection in a heated microchannel. A conjugate heat transfer model was set up using a commercial software STAR-CD to investigate the localized flow and heat transfer in a microchannel. The model was then solved using typical flow, heat transfer and dimensional parameters. The temperature distributions in both the solid and fluid region and the flow field in terms of velocity and pressures were shown and discussed with the help of the numerical simulation.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131464970","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
ENHANCED JET IMPINGEMENT HEAT TRANSFER WITH CROSSFLOW AT LOW REYNOLDS NUMBERS 低雷诺数下横流增强射流冲击换热
Journal of Electronics Manufacturing Pub Date : 1999-06-01 DOI: 10.1142/S096031319900009X
G. Failla, E. H. Bishop, J. Liburdy
{"title":"ENHANCED JET IMPINGEMENT HEAT TRANSFER WITH CROSSFLOW AT LOW REYNOLDS NUMBERS","authors":"G. Failla, E. H. Bishop, J. Liburdy","doi":"10.1142/S096031319900009X","DOIUrl":"https://doi.org/10.1142/S096031319900009X","url":null,"abstract":"An experimental investigation was conducted to determine the heat transfer and flow characteristics for a finned surface subject to circular impinging jets with independently controlled crossflow. The jet array was configured to impinge on the top of the rectangular fins while the crossflow was directed through the channels formed by the fins. Tests were performed to determine the overall heat transfer under conditions of only jet impingement, only crossflow and combined jet with crossflow, for several fin geometries. Results are presented in terms of necessary pressure to drive the flow as well as in terms of the jet and channel Reynolds numbers. Nusselt number correlations indicated the ability to optimize the jet and crossflow with the fin geometry to obtain specific heat transfer conditions.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"478 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124405257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
A FRAMEWORK FOR THE FLEXIBLE GROUPING OF PRODUCTS FOR DISASSEMBLY 一种用于可拆卸的产品灵活分组的框架
Journal of Electronics Manufacturing Pub Date : 1999-03-01 DOI: 10.1142/S0960313199000283
S. Viswanathan, V. Allada
{"title":"A FRAMEWORK FOR THE FLEXIBLE GROUPING OF PRODUCTS FOR DISASSEMBLY","authors":"S. Viswanathan, V. Allada","doi":"10.1142/S0960313199000283","DOIUrl":"https://doi.org/10.1142/S0960313199000283","url":null,"abstract":"The increased scrutiny of a product's effects on the environment has led industry to embrace Environment Conscious Design and Manufacture (ECDM) practices. Disassembly of a product at the end of its useful life is an integral part of the ECDM paradigm. Disassembly facilitates the end-of-product life options such as recycling, remanufacture, reuse and safe disposal. As industries take active steps to move to a \"greener\" economy, the emergence of dedicated disassembly facilities is foreseeable. The increasing variety of new products requires that these disassembly factories be able to handle a wide spectrum of products. Today, dedicated disassembly facilities exist for disassembling high value products such as computers and automobiles. However, the flexibility of a disassembly facility is particularly important to accommodate the disassembly of moderate to low value, and high variety consumer products. We address this issue by proposing a framework for the formation of product groups based on their disassembly characteristics as a step towards increasing the flexibility of disassembly factories. A two-level hierarchy of generic disassembly characteristics has been employed to evaluate the similarity of diverse products. We have used a modified version of the \"growing neural gas\" neural network model to classify the products. The first level or primary Disassembly Product Groups (DPGs) are obtained based on similarities in product structure. They are further subdivided into secondary DPGs based on the disassembly resource requirements of the products. An implementation for the disassembly-oriented grouping using a few example products has been carried out for demonstration purposes.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115533653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
MULTI-LIFECYCLE PRODUCT RECOVERY FOR ELECTRONIC PRODUCTS 电子产品多生命周期产品回收
Journal of Electronics Manufacturing Pub Date : 1999-03-01 DOI: 10.1142/S0960313199000246
Mengchu Zhou, R. Caudill, Donald H. Sebastian, Bin Zhang
{"title":"MULTI-LIFECYCLE PRODUCT RECOVERY FOR ELECTRONIC PRODUCTS","authors":"Mengchu Zhou, R. Caudill, Donald H. Sebastian, Bin Zhang","doi":"10.1142/S0960313199000246","DOIUrl":"https://doi.org/10.1142/S0960313199000246","url":null,"abstract":"Sustainable industrial development seeks to meet current needs of society without compromising the ability of future generations to satisfy their own needs. In order to be able to sustain further the growth and development, we have to become more environmentally conscious in the development, manufacturing, use, and post-life treatment of products. Based on the concept of design for environment and multi-lifecycle engineering, this paper introduces a multi-lifecycle product recovery model, optimal retirement planning, and design selection methods. Two electronic products are used to illustrate the proposed concepts and methods. The results are useful in helping designers take into account the environmental impact into their product and process design activities.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"636 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120885857","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 51
COMPUTER TAKE-BACK AND RECYCLING: AN ECONOMIC ANALYSIS FOR USED CONSUMER EQUIPMENT 电脑回收与再循环:二手消费设备的经济分析
Journal of Electronics Manufacturing Pub Date : 1999-03-01 DOI: 10.1142/S0960313199000295
L. Jung, T. Bartel
{"title":"COMPUTER TAKE-BACK AND RECYCLING: AN ECONOMIC ANALYSIS FOR USED CONSUMER EQUIPMENT","authors":"L. Jung, T. Bartel","doi":"10.1142/S0960313199000295","DOIUrl":"https://doi.org/10.1142/S0960313199000295","url":null,"abstract":"The exponential evolution of electronic technology is resulting in rapid growth and turnover in personal computer usage. As companies, governments, institutions and consumers increase their use of computers, more computers are also deemed obsolete. The lack of outlets for recycling used computer equipment at end-of-life is spurring broad interest in the economics of computer recycling programs. This paper presents economic data from the San Jose Consumer Computer Collection and Recycling Pilot and compares the Pilot data to economics from alternate electronic equipment management scenarios. The effect on computer recycling economics from the regulation of computer cathode ray tubes is also summarized.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"328 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125204605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 25
Book Review: "Green Electronics/Green Bottom Line: Environmentally Responsible Engineering", Lee H. Goldberg (Editor), Wendy Middleton (Assistant Editor) 书评:《绿色电子/绿色底线:环境责任工程》，李·h·戈德堡(编辑)，温迪·米德尔顿(助理编辑)
Journal of Electronics Manufacturing Pub Date : 1999-03-01 DOI: 10.1142/S0960313199000313
S. Gupta
{"title":"Book Review: \"Green Electronics/Green Bottom Line: Environmentally Responsible Engineering\", Lee H. Goldberg (Editor), Wendy Middleton (Assistant Editor)","authors":"S. Gupta","doi":"10.1142/S0960313199000313","DOIUrl":"https://doi.org/10.1142/S0960313199000313","url":null,"abstract":"","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116942142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
ANALYSIS OF DESIGN EFFICIENCY FOR THE DISASSEMBLY OF MODULAR ELECTRONIC PRODUCTS 模块化电子产品拆卸的设计效率分析
Journal of Electronics Manufacturing Pub Date : 1999-03-01 DOI: 10.1142/S0960313199000301
P. Veerakamolmal, S. Gupta
{"title":"ANALYSIS OF DESIGN EFFICIENCY FOR THE DISASSEMBLY OF MODULAR ELECTRONIC PRODUCTS","authors":"P. Veerakamolmal, S. Gupta","doi":"10.1142/S0960313199000301","DOIUrl":"https://doi.org/10.1142/S0960313199000301","url":null,"abstract":"In this paper, we present a technique for analyzing the design efficiency of electronic products, in order to study the effect of end-of-life (EOL) disassembly and disposal on the environment. The design efficiency is measured using a Design for Disassembly Index (DfDI). DfDI uses a disassembly tree (DT) which relies on the product's structure. The DT can be used to identify the precedent relationships that define the hierarchy of the product's structure (which in turn, represents the order in which components can be retrieved). DfDI can be used to analyze the merits and drawbacks of different product designs. The index offers designers with an important measure to help improve the future products. We provide a comprehensive procedure for developing the index and demonstrate its application through an example.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"471 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133357861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 98
PRODUCT END-OF-LIFE STRATEGY CATEGORIZATION DESIGN TOOL 产品报废策略分类设计工具
Journal of Electronics Manufacturing Pub Date : 1999-03-01 DOI: 10.1142/S0960313199000271
C. Rose, K. Ishii
{"title":"PRODUCT END-OF-LIFE STRATEGY CATEGORIZATION DESIGN TOOL","authors":"C. Rose, K. Ishii","doi":"10.1142/S0960313199000271","DOIUrl":"https://doi.org/10.1142/S0960313199000271","url":null,"abstract":"Prediction of end-of-life strategies early in design leads to improved eco-efficient product and processes. This paper describes the development of an internet-based tool, End-of-Life Design Advisor (ELDA), that guides product developers to specify appropriate end-of-life strategies. The study began with surveys of end-of-life strategies currently used in the electronics industry that identified key product characteristics that influence end-of-life strategies. The survey led to a scheme for identifying suitable product end-of-life strategies early in the design cycle of a broad range of products. The end-of-life strategy categorization in ELDA is a result of statistical analysis applied to 12 characteristics across 20 products. The tool aids product designers, recycling technology developers, and policy makers.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116237689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 69
THE "GREEN DESIGN ADVISOR": A TOOL FOR DESIGN FOR ENVIRONMENT “绿色设计顾问”:为环境设计的工具
Journal of Electronics Manufacturing Pub Date : 1999-03-01 DOI: 10.1142/S0960313199000258
K. Feldmann, O. Meedt, S. Trautner, H. Scheller, W. Hoffman
{"title":"THE \"GREEN DESIGN ADVISOR\": A TOOL FOR DESIGN FOR ENVIRONMENT","authors":"K. Feldmann, O. Meedt, S. Trautner, H. Scheller, W. Hoffman","doi":"10.1142/S0960313199000258","DOIUrl":"https://doi.org/10.1142/S0960313199000258","url":null,"abstract":"Since European and national legislation is shifting responsibility for discarded products more and more to the producer, the need for efficient tools to evaluate and improve products with regard to their environmental impact is increasing. In this paper, the results of a beneficial cooperation between industry and university in the area of environmental evaluation and optimization of products is presented. The developed Design for Environment (DFE) tool \"Green Design Advisor\" (GDA) is currently implemented as a best practice DFE-tool into industry. As the knowledge about the end-of-life behavior of a product is essential for the environmental evaluation, a specific method for the end-of-life simulation is an important issue of the paper. Furthermore, the integration and enlargement of this end-of-life related evaluation into a DFE-method is described. The resulting tool also includes features to detect environmental product design weaknesses, by using special characteristic values that have been developed. Those allow, along with a tailored integrated optimization sequence, the efficient use of the software to achieve significant design improvements.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114416679","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 49
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