{"title":"采用热机械偏转系统(tmds)的高加速焊点可靠性试验","authors":"H. Pang, K. H. Ang, X. Shi, Z. Wang","doi":"10.1142/S0960313100000058","DOIUrl":null,"url":null,"abstract":"A Thermo-Mechanical Deflection System (TMDS) test method has been developed for evaluating the fatigue performance of solder joints in printed circuit board (PCB) assemblies. The TMDS test imparts cyclic twisting deflections on an assembled PCB test vehicle which is tested under controlled iso-thermal conditions in a thermal chamber. Tests were conducted at various angles of twist and isothermal conditions at 100°C and 25°C. Failure analysis using SEM showed that the solder joint failure for the TMDS test is comparable to the failure mechanisms for ATC test failures for solder joints. Weibull failure distribution plots for TMDS and ATC tests were compared and a Scale Factor (SF) was used to correlate the test results.","PeriodicalId":309904,"journal":{"name":"Journal of Electronics Manufacturing","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"HIGHLY ACCELERATED SOLDER JOINT RELIABILITY TEST USING A THERMO-MECHANICAL DEFLECTION SYSTEM (TMDS)\",\"authors\":\"H. Pang, K. H. Ang, X. Shi, Z. Wang\",\"doi\":\"10.1142/S0960313100000058\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A Thermo-Mechanical Deflection System (TMDS) test method has been developed for evaluating the fatigue performance of solder joints in printed circuit board (PCB) assemblies. The TMDS test imparts cyclic twisting deflections on an assembled PCB test vehicle which is tested under controlled iso-thermal conditions in a thermal chamber. Tests were conducted at various angles of twist and isothermal conditions at 100°C and 25°C. Failure analysis using SEM showed that the solder joint failure for the TMDS test is comparable to the failure mechanisms for ATC test failures for solder joints. Weibull failure distribution plots for TMDS and ATC tests were compared and a Scale Factor (SF) was used to correlate the test results.\",\"PeriodicalId\":309904,\"journal\":{\"name\":\"Journal of Electronics Manufacturing\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronics Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1142/S0960313100000058\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronics Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1142/S0960313100000058","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
HIGHLY ACCELERATED SOLDER JOINT RELIABILITY TEST USING A THERMO-MECHANICAL DEFLECTION SYSTEM (TMDS)
A Thermo-Mechanical Deflection System (TMDS) test method has been developed for evaluating the fatigue performance of solder joints in printed circuit board (PCB) assemblies. The TMDS test imparts cyclic twisting deflections on an assembled PCB test vehicle which is tested under controlled iso-thermal conditions in a thermal chamber. Tests were conducted at various angles of twist and isothermal conditions at 100°C and 25°C. Failure analysis using SEM showed that the solder joint failure for the TMDS test is comparable to the failure mechanisms for ATC test failures for solder joints. Weibull failure distribution plots for TMDS and ATC tests were compared and a Scale Factor (SF) was used to correlate the test results.
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