IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)最新文献_第2页

An integrated environment for the simulation of electrical, thermal and electromagnetic interactions in high-performance integrated circuits 用于模拟高性能集成电路中的电、热和电磁相互作用的集成环境

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819229

H. Gutierrez, C. Christoffersen, M. Steer

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引用次数: 21

Limitations due to systematic phase errors on the extraction of loss tangent from micron-sized transmission line test structures 系统相位误差对微米级传输线测试结构中损耗正切提取的限制

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819195

R. Friar, D. Neikirk

引用次数: 4

Domain decomposition approach for capacitance computation of non-orthogonal interconnect structures 非正交互连结构电容计算的区域分解方法

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819198

V. Veremey, R. Mittra

引用次数: 1

Radiated emission from pin-fin heat sink mounted on an EBGA package 安装在EBGA封装上的鳍片散热器的辐射发射

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819225

P. Qu, M. Iyer, Y. Qiu

引用次数: 6

RF characterization of low cost MCM-D substrates, manufactured on large area panels 在大面积面板上制造的低成本MCM-D基板的射频特性

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819206

D. Cottet, M. Scheffler, J. Grzyb, B. Oswald, G. Troster

引用次数: 3

Modeling of simultaneous switching output by equivalent source impedance 等效源阻抗的同步开关输出建模

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819218

R. Lutz, A. Weisshaar, V. Tripathi, T. Arabi, A. Lee

引用次数: 0

Asymptotically zero power dissipation gigahertz clock distribution networks 渐近零功耗千兆赫时钟分配网络

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819193

P. Zarkesh-Ha, J. Meindl

引用次数: 3

RF interconnect for multi-Gbit/sec board-level clock distribution 用于多gbit /sec板级时钟分配的射频互连

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819188

Woonghwan Ryu, Hyungsoo Kim, Seungyoung Ahn, Namhoon Kim, Baekkyu Choi, Joungho Kim

引用次数: 2

Design and performance evaluation of chip capacitors on microprocessor packaging 微处理器封装上芯片电容器的设计和性能评估

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819220

T. Yew, Yuan-liang Li, C. Chung, D. Figueroa

引用次数: 6

Electrical performance of buried capacitors in multi-layered PCBs 多层pcb中埋地电容器的电性能

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI: 10.1109/EPEP.1999.819204

A. Madou, L. Martens

引用次数: 1