RF characterization of low cost MCM-D substrates, manufactured on large area panels

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819206

D. Cottet, M. Scheffler, J. Grzyb, B. Oswald, G. Troster

引用次数: 3

Abstract

This article presents the RF characterization results of a large-area MCM-D technology developed within the EU LAP project. Microstrip lines were simulated, designed, and manufactured in several material combinations. Measurements up to 120 GHz showed good coincidence between simulation and reality. Future work is dedicated to filters and antennas in the 77 GHz range.

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在大面积面板上制造的低成本MCM-D基板的射频特性

本文介绍了在EU LAP项目中开发的大面积MCM-D技术的RF表征结果。微带线模拟，设计和制造几种材料组合。高达120 GHz的测量结果表明，仿真与实际吻合良好。未来的工作将致力于77 GHz范围内的滤波器和天线。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

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