多层pcb中埋地电容器的电性能

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Pub Date : 1999-10-25 DOI:10.1109/EPEP.1999.819204

A. Madou, L. Martens

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引用次数: 1

摘要

本文介绍了原型埋地电容器的设计，并给出了在这些测试结构上进行的一些测量和建模结果。这项工作是在欧洲英国-欧元基金资助的项目下进行的，包括。该项目的目标是开发新的材料和制造工艺，将无源元件(R, L和C)嵌入层压板材料制造的印刷布线结构中。

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Electrical performance of buried capacitors in multi-layered PCBs

This paper describes the design of prototype buried capacitors and presents some measurement and modeling results performed on these test structures. This work is being carried out under a European Brite-EuRAM funded project, COMPRISE. The objective of this project is to develop new materials and manufacturing processes to embed passive components (R, L, and C) within printed wiring structures fabricated from laminate materials.

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IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)

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