{"title":"安装在EBGA封装上的鳍片散热器的辐射发射","authors":"P. Qu, M. Iyer, Y. Qiu","doi":"10.1109/EPEP.1999.819225","DOIUrl":null,"url":null,"abstract":"In this paper, radiated emissions from a commercial pin fin heat sink mounted on an EBGA package were studied. The effect of the pin length of the heat sink on the radiated field was analyzed. Finally, the mechanism of radiation enhancement was investigated, both from electromagnetic field and circuit points of view.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"80 11","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Radiated emission from pin-fin heat sink mounted on an EBGA package\",\"authors\":\"P. Qu, M. Iyer, Y. Qiu\",\"doi\":\"10.1109/EPEP.1999.819225\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, radiated emissions from a commercial pin fin heat sink mounted on an EBGA package were studied. The effect of the pin length of the heat sink on the radiated field was analyzed. Finally, the mechanism of radiation enhancement was investigated, both from electromagnetic field and circuit points of view.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"80 11\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819225\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819225","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Radiated emission from pin-fin heat sink mounted on an EBGA package
In this paper, radiated emissions from a commercial pin fin heat sink mounted on an EBGA package were studied. The effect of the pin length of the heat sink on the radiated field was analyzed. Finally, the mechanism of radiation enhancement was investigated, both from electromagnetic field and circuit points of view.