2019 Devices for Integrated Circuit (DevIC)最新文献

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A Low Power Hardware Implementation of Lifting based Reversible Watermarking for Medical Image 基于提升的医学图像可逆水印的低功耗硬件实现
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783370
Poulami Jana, G. Maity, Himadri S. Mandal
{"title":"A Low Power Hardware Implementation of Lifting based Reversible Watermarking for Medical Image","authors":"Poulami Jana, G. Maity, Himadri S. Mandal","doi":"10.1109/DEVIC.2019.8783370","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783370","url":null,"abstract":"A lifting domain reversible data hiding is presented here. A content based watermark is produced from selective $(4times 4)$ sized coefficient blocks of particular sub-band. One covert key is utilized to secure the watermark for access management which is specified by user. The secure watermark is implanted within same coefficient block $(4times 4)$. In receiver side the retrieval of original image is done by the authentic user's secure key. For real time application the ‘very large scale integration’ (VLSI) architecture of this proposed encoder is designed in hardware. Simulation of the encoder is done by ‘field programmable gate array’ (FPGA) kit. The experimentation is performed over a range of benchmark images. The results justify the supremacy of the method. The encoder module consumes only 59.20mW power when operated at 120.135MHz frequency in case of real time implementation.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122874177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
SPICE Parameter Extraction of Tri-Gate FinFETs-An Integrated Approach 三栅极finfet的SPICE参数提取——一种集成方法
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783725
Tara Prasanna Dash, S. Das, S. Dey, E. Mohapatra, J. Jena, C. K. Maiti
{"title":"SPICE Parameter Extraction of Tri-Gate FinFETs-An Integrated Approach","authors":"Tara Prasanna Dash, S. Das, S. Dey, E. Mohapatra, J. Jena, C. K. Maiti","doi":"10.1109/DEVIC.2019.8783725","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783725","url":null,"abstract":"The FinFET transistor is now considered the most probable successor of the bulk MOSFET transistor in the global race for miniaturization in the field of micro- and nanoelectronics. The development of integrated circuits using FinFETs is made possible only by the use of their compact models. These models must predict precisely the electrical behavior of these devices advanced technologies. In this work, we show an integrated approach for SPICE parameter extraction explicitly for nanoscale FinFETs, which is validated by comparisons with simulation results. We discuss in detail the platform necessary for the development of the model and automated SPICE parameter extraction. The predictive capability of TCAD to estimate the SPICE model parameters from process-based on the physical variations of process parameters has been examined.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"240 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132605205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Electromagnetic Bandgap Formation in Two-Dimensional Photonic Crystal Structure with DNG Materials under TE Mode TE模式下DNG材料二维光子晶体结构的电磁带隙形成
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783914
P. Chakraborty, Ratul Ghosh, Anwesha Adhikary, A. Deyasi, A. Sarkar
{"title":"Electromagnetic Bandgap Formation in Two-Dimensional Photonic Crystal Structure with DNG Materials under TE Mode","authors":"P. Chakraborty, Ratul Ghosh, Anwesha Adhikary, A. Deyasi, A. Sarkar","doi":"10.1109/DEVIC.2019.8783914","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783914","url":null,"abstract":"Bandgap width within first Brillouin zone in metamaterial-based two-dimensional photonic crystal structure is analytically computed using plane wave expansion method. A wider range of negative refractive index is considered for simulation purpose within physically feasible limit whereas rectangular geometrical shape is taken into account for the analysis with TE mode of propagation. Artificial materials in presence of air holes are considered to achieve negative index, and results are compared with that obtained for conventional SiO2-air material system with equivalent dimensional configuration. Coordinates of two peak points, $hbox{`}Gammahbox{'}$ point and ‘X’, point are noted for all the DNG materials which give the indication of blueshift of the valence region with change of negative refractive index. Simulated findings speak in favor of multiple forbidden regions for some specific material systems which can be utilized to design photonic multi-channel filter in beyond THz region.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125679307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Surface potential based Analytical Modeling of Graded Channel Strained High-k Gate stack Dual-Material Double Gate MOSFET 基于表面电位的梯度通道应变高k栅极堆双材料双栅极MOSFET解析建模
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783284
Pritha Banerjee, Priyanka Saha, Dinesh Kumar Dash, S. Sarkar
{"title":"Surface potential based Analytical Modeling of Graded Channel Strained High-k Gate stack Dual-Material Double Gate MOSFET","authors":"Pritha Banerjee, Priyanka Saha, Dinesh Kumar Dash, S. Sarkar","doi":"10.1109/DEVIC.2019.8783284","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783284","url":null,"abstract":"Gate work function engineered MOSFET coupled with the channel and dielectric engineering benefits has always been an important topic owing to their supreme immunity over Short Channel Effects (SCEs). In this paper, the analytical model of a Graded Channel Strained High-k Gate stack Dual-Material Double Gate MOSFET has been presented by solving the Poisson's equation in 2D and following parabolic potential approximation approach. The analytical results have been substantiated by ATLAS simulated data.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114583333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
RF/Analog & Linearity performance analysis of a downscaled JL DG MOSFET on GaAs substrate for Analog/mixed signal SOC applications 用于模拟/混合信号SOC应用的GaAs衬底上的缩小JL DG MOSFET的RF/模拟和线性性能分析
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783341
Biswajit Baral, S. Biswal, S. Swain, S. K. Das, D. Nayak, Dhananjaya Tripathy
{"title":"RF/Analog & Linearity performance analysis of a downscaled JL DG MOSFET on GaAs substrate for Analog/mixed signal SOC applications","authors":"Biswajit Baral, S. Biswal, S. Swain, S. K. Das, D. Nayak, Dhananjaya Tripathy","doi":"10.1109/DEVIC.2019.8783341","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783341","url":null,"abstract":"With time the design of RF and Analog application based circuits in MOSFET industry is changing and day by day it's becoming more and more difficult as device modeling has now entered the deep-subnanometer regime. Performance of junction less transistor is remarkable in digital application due to their ease of fabrication and superior SCEs. This paper highlights the DC, ANALOG, RF and LINEARITY performance of a Junction less Double Gate MOSFET (JL DG MOSFET) by downscaling the Channel length with the help of numerical TCAD device simulator (SILVACO). The figure of merits for DC, ANALOG, RF & LINEARITY parameters for example Transconductance $(mathrm{g}_{mathrm{m}})$, Gain transconductance frequency product (GTFP), output resistance $(mathrm{R}_{mathrm{o}mathrm{u}mathrm{t}})$, cut-off frequency $(mathrm{f}_{mathrm{T}})$, Gain bandwidth product (GBW), Transconductance generation factor $(mathrm{g}_{mathrm{m}}/mathrm{I}_{mathrm{d}})$, maximum frequency $(mathrm{f}_{max})$, Intermodulation distortion (IMD), variable intercept point (VIP) are studied and impact of downscaling in gate length have been recorded. The results conclude that down scaled junction less DG MOSFET show a great pledge to turn out to be a feasible competitor for use in SOC application.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121442913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Performance Analysis of FinFET device Using Qualitative Approach for Low-Power applications 基于定性方法的低功耗FinFET器件性能分析
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783754
Shekhar Verma, S. Tripathi, Mohinder Bassi
{"title":"Performance Analysis of FinFET device Using Qualitative Approach for Low-Power applications","authors":"Shekhar Verma, S. Tripathi, Mohinder Bassi","doi":"10.1109/DEVIC.2019.8783754","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783754","url":null,"abstract":"The introduction of Field Effect Transistor (FinFET) Technology played a leading contender in today microelectronics. FinFET structure allows to scale the device at sub-nanometer. Short channel effects can be suppressed by formation of ultra-thin fin in FinFET device. In this paper we compared the performance of the 20nm FinFET device by using different dielectric materials. We have considered only n-channel FinFET device. Simulation carried on the electron mobility, potential distribution, energy band of hole and electron, on-off current ratio (Ion/Ioff) and power dissipation of device with respect to the applied gate voltage. Mobility enhancement and higher current ratio (Ion/Ioff) is observed in proposed FinFET device having high k-dielectric material at lower voltage. This designed can be useful for low power applications due to low power dissipation. In high k-dielectric material, 1.41% improvement is observed in potential voltage with respect to low k- dielectric material when $mathbf{V}_{mathbf{gs}}$ at low voltage and 0.98% improvement is observed when $mathbf{V}_{mathbf{gs}}$ at high voltage. In high k- dielectric material 15% hike is observed in the energy conduction band as compared to low k-dielectric material when $mathbf{V}_{mathbf{gs}}$ at low voltage and 14% hike is observed when $mathbf{v}_{mathbf{gs}}$ at high voltage.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123296096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Analytical Modeling and Simulation of Low Power Salient Source Double Gate TFET 低功率凸源双栅极TFET的解析建模与仿真
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783677
Bijoy Goswami, Debadipta Basak, A. Bhattacharya, Koelgeet Kaur, Sutanni Bhowmick, S. Sarkar
{"title":"Analytical Modeling and Simulation of Low Power Salient Source Double Gate TFET","authors":"Bijoy Goswami, Debadipta Basak, A. Bhattacharya, Koelgeet Kaur, Sutanni Bhowmick, S. Sarkar","doi":"10.1109/DEVIC.2019.8783677","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783677","url":null,"abstract":"The analytical surface potential model of 22nm salient source Double Gate TFET (SS-DG-TFET) is presented in this paper. The surface potential is analyzed as the performance parameter along with an assessment of improved ON/ OFF current ratio. The variation of tunnel current is examined under same front and back gate bias together with identical oxide thickness. The source region has been extended symmetrically in both directions in order to enhance the conductivity of the channel region and it has been efficiently deployed in the proposed model. The execution of low power functionality and lower sub-threshold slope is also established in this model. The analytical results have been suitably validated using Silvaco, Atlas.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130188227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Improvement of the Gain Accuracy of the Instrumentation Amplifier Using a Very High Gain Operational Amplifier 用高增益运算放大器提高仪表放大器的增益精度
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783414
Maitraiyee Konar, R. Sahu, S. Kundu
{"title":"Improvement of the Gain Accuracy of the Instrumentation Amplifier Using a Very High Gain Operational Amplifier","authors":"Maitraiyee Konar, R. Sahu, S. Kundu","doi":"10.1109/DEVIC.2019.8783414","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783414","url":null,"abstract":"This paper evaluates the performance of three operational amplifier (Op-Amp) based instrumentation amplifier (INA) topology using two variants of Op-Amp - one with a very high gain with respect to the other Op-Amp topology. The gain accuracy and common mode rejection ratio (CMRR) of the INA is improved with the use of the very high gain Op-Amp designed using a folded cascode amplifier. The CMRR of the INA using folded cascade Op-Amp is 114 dB which is 43 dB higher to that of INA using differential amplifier.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125277363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Adaptive Jaya Optimization Technique for Economic Load Dispatch Considering Valve Point Effect 考虑阀点效应的经济负荷调度自适应Jaya优化技术
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/DEVIC.2019.8783691
S. Basak, Swaraj Banerjee
{"title":"Adaptive Jaya Optimization Technique for Economic Load Dispatch Considering Valve Point Effect","authors":"S. Basak, Swaraj Banerjee","doi":"10.1109/DEVIC.2019.8783691","DOIUrl":"https://doi.org/10.1109/DEVIC.2019.8783691","url":null,"abstract":"ELD with the help of Jaya Optimization Technique has been proved as one of the better options. Along with the cost curves or cost coefficients valve point effect has also very important impact in ELD. So in this paper, for ELD with valve point effect has been optimized with the help of Adaptive Jaya Optimization Technique. 13 thermal unit has been taken to get the optimal power output and optimal cost, which has been compared to the other optimization techniques' results. Advantage of this proposed optimization technique has been shown in the current work.","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121180130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Message from General Chair & Editor 总主席兼编辑的信息
2019 Devices for Integrated Circuit (DevIC) Pub Date : 2019-03-01 DOI: 10.1109/devic.2019.8783299
{"title":"Message from General Chair & Editor","authors":"","doi":"10.1109/devic.2019.8783299","DOIUrl":"https://doi.org/10.1109/devic.2019.8783299","url":null,"abstract":"","PeriodicalId":294095,"journal":{"name":"2019 Devices for Integrated Circuit (DevIC)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131687331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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