三栅极finfet的SPICE参数提取——一种集成方法

Tara Prasanna Dash, S. Das, S. Dey, E. Mohapatra, J. Jena, C. K. Maiti
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引用次数: 1

摘要

在微电子和纳米电子学领域的全球小型化竞赛中,FinFET晶体管现在被认为是最有可能取代大块MOSFET晶体管的产品。使用finfet的集成电路的发展只有通过使用其紧凑的模型才有可能。这些模型必须精确地预测这些设备的电气行为。在这项工作中,我们展示了一种用于纳米级finfet的SPICE参数提取的集成方法,并通过与仿真结果的比较验证了这一方法。详细讨论了模型开发和SPICE参数自动提取所需的平台。考察了基于工艺参数物理变化的TCAD对SPICE模型参数的预测能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SPICE Parameter Extraction of Tri-Gate FinFETs-An Integrated Approach
The FinFET transistor is now considered the most probable successor of the bulk MOSFET transistor in the global race for miniaturization in the field of micro- and nanoelectronics. The development of integrated circuits using FinFETs is made possible only by the use of their compact models. These models must predict precisely the electrical behavior of these devices advanced technologies. In this work, we show an integrated approach for SPICE parameter extraction explicitly for nanoscale FinFETs, which is validated by comparisons with simulation results. We discuss in detail the platform necessary for the development of the model and automated SPICE parameter extraction. The predictive capability of TCAD to estimate the SPICE model parameters from process-based on the physical variations of process parameters has been examined.
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