2010 IEEE 14th Workshop on Signal Propagation on Interconnects最新文献_第3页

Electrical and thermal behaviour of nanopackaging interconnects with conventional and innovative materials 纳米封装与传统和创新材料互连的电学和热行为

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483568

A. Chiariello, A. Maffucci, G. Miano

引用次数: 3

An application of Volterra series to IC buffer models Volterra系列在集成电路缓冲模型中的应用

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483562

M. Telescu, I. Stievano, F. Canavero, N. Tanguy

引用次数: 8

Nearfield-immunity scan on printed circuit board level 印刷电路板级近场抗扰扫描

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483560

Oliver Kröning, Mario Krause, M. Leone

引用次数: 9

Effect of mixed-reference planes on single-ended and differential links in multilayer substrates 混合参考平面对多层基板中单端和差分链路的影响

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483587

S. Müller, R. Rímolo-Donadío, M. Kotzev, H. Brüns, C. Schuster

引用次数: 4

Efficient passivity verification of delayed rational function macromodels from networks characterized by tabulated data 表列数据网络中延迟有理函数宏模型的有效无源验证

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483556

A. Charest, M. Nakhla, R. Achar

引用次数: 2

A novel broadband boundary element approach for RL-extraction in lossy 3D interconnects 一种用于有损三维互连中rl提取的宽带边界元新方法

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483584

M. Al-Qedra, J. Aronsson, V. Okhmatovski

引用次数: 0

Addressing practical issues with banded-variables in an MNA-based optoelectronic simulation framework 在基于mna的光电仿真框架中解决带变量的实际问题

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483565

T. Smy, P. Gunupudi

引用次数: 1

Benefit on interconnect performance of a relaxed wire density in a 45 nm node of the Back End of Line 后端45nm节点放宽导线密度对互连性能的好处

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483594

S. de Rivaz, A. Farcy, D. Deschacht, T. Lacrevaz, B. Fléchet

引用次数: 0

Crosstalk mitigation enhanced by reference conductor position 参考导体位置增强了串扰缓解

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483549

Kachout Mnaouer, B. H. T. Jamel, Choubani Fethi

引用次数: 1

Degradation of digital signal characteristics due to intermediate stages of interconnect failure 由于中间阶段互连故障导致的数字信号特性的退化

2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483578

Daeil Kwon, M. Azarian, M. Pecht

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引用次数: 3