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2010 IEEE 14th Workshop on Signal Propagation on Interconnects最新文献

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Applicability of time domain and z-domain Vector Fitting to rational modeling from time domain responses with consideration to circuit solver integration method 时域和z域矢量拟合在考虑电路求解器积分法的时域响应理性建模中的适用性
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483573
A. Ubolli, B. Gustavsen
{"title":"Applicability of time domain and z-domain Vector Fitting to rational modeling from time domain responses with consideration to circuit solver integration method","authors":"A. Ubolli, B. Gustavsen","doi":"10.1109/SPI.2010.5483573","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483573","url":null,"abstract":"Linear macromodels can be extracted from simulated time domain responses, for instance using the Time Domain Vector Fitting (TD-VF) and the z-domain Vector Fitting (ZD-VF) method. In this paper we show that the TD-VF yields more accurate results than ZD-VF, mainly because of its ability to handle truncated responses. This makes TD-VF more applicable to practical applications. In addition, we show that with TD-VF one may in certain situations greatly improve the accuracy of the extracted model by introducing the same numerical integration method in the extraction routine as the one used by the circuit simulator.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132802375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Crosstalk modelling and analysis of interconnects based on carbon nanotubes bundles 基于碳纳米管束的互连串扰建模与分析
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483543
L. Egiziano, A. Giustiniani, G. Spinelli, V. Tucci, W. Zamboni
{"title":"Crosstalk modelling and analysis of interconnects based on carbon nanotubes bundles","authors":"L. Egiziano, A. Giustiniani, G. Spinelli, V. Tucci, W. Zamboni","doi":"10.1109/SPI.2010.5483543","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483543","url":null,"abstract":"In this paper, the crosstalk problem for carbon nanotubes (CNTs) bundle interconnects is dealt with. The CNT bundle is modelled by using the multiconductor transmission line (MTL) theory and, from this, a compact coupled equivalent conductors (CEC) model is derived. The influence of two modelling uncertainties is investigated. In particular, the pattern of the conducting CNTs in the transverse cross section and the size of the terminations. The results obtained for the full MTL model are compared to those obtained by CEC.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130947202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Measurement of on-chip I/O power supply noise and correlation verification between noise magnitude and delay increase due to SSO 片上I/O电源噪声测量及单点登录引起的噪声幅度与时延增加的相关性验证
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483591
Y. Takai, Y. Ogasahara, M. Hashimoto, T. Onoye
{"title":"Measurement of on-chip I/O power supply noise and correlation verification between noise magnitude and delay increase due to SSO","authors":"Y. Takai, Y. Ogasahara, M. Hashimoto, T. Onoye","doi":"10.1109/SPI.2010.5483591","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483591","url":null,"abstract":"This paper presents measurement results of on-chip noise on power and ground rings for I/O (input/output) cells in a simple test structure fabricated in 90nm process. We also show measured timings of an output signal from chip to PCB board, and examine the relation between the magnitude of I/O power supply noise and the output transition timings.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"214 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116158419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Performance of signal link paths in presence of signal reference planes of EBG type 有EBG型信号参考平面时信号链路路径的性能
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483559
V. Ricchiuti, F. de Paulis, A. Orlandi
{"title":"Performance of signal link paths in presence of signal reference planes of EBG type","authors":"V. Ricchiuti, F. de Paulis, A. Orlandi","doi":"10.1109/SPI.2010.5483559","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483559","url":null,"abstract":"In the recent years the ever increasing demand for more bandwidth and higher data rate in telecommunication world led to develop integrated circuits with smaller and faster transistors. Low power supply voltage levels are used for reducing the semiconductor power consumption, leading to smaller signal swing and noise margin on board. In this condition the noise on the power bus becomes one of the main concerns for the board designer. A good technique for suppressing the power bus noise consists in using EBG (Electromagnetic Band-Gap) structures on the power/ground planes. But, in the presence of signals referenced to EBG type of plane, attention needs to be paid in analyzing the performance of the signal link paths. In this work, starting from measurements in the frequency domain, the performances of signals propagating on single ended and differential striplines are studied, when EBG layers provide the return to the current path.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116071764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Passive parametric macromodeling from sampled frequency data 基于采样频率数据的被动参数宏观建模
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483554
P. Triverio, M. Nakhla, S. Grivet-Talocia
{"title":"Passive parametric macromodeling from sampled frequency data","authors":"P. Triverio, M. Nakhla, S. Grivet-Talocia","doi":"10.1109/SPI.2010.5483554","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483554","url":null,"abstract":"We present an efficient algorithm for the generation of passive parametric macromodels from impedance, admittance, or scattering frequency samples. The model formulation includes design variables in symbolic form and guarantees stability, causality, and passivity by construction. Model accuracy and efficiency are superior to previous solutions, because of a generalized formulation based on parameter-dependent poles. Two application examples demonstrate the excellent algorithm performance in modeling linear passive devices and interconnects.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127196030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 25
Numerical validation of a procedure for direct identification of passive linear multiport with convex programming 用凸规划直接识别无源线性多端口程序的数值验证
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483546
A. Chiariello, M. de Magistris, L. De Tommasi, D. Deschrijver, T. Dhaene
{"title":"Numerical validation of a procedure for direct identification of passive linear multiport with convex programming","authors":"A. Chiariello, M. de Magistris, L. De Tommasi, D. Deschrijver, T. Dhaene","doi":"10.1109/SPI.2010.5483546","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483546","url":null,"abstract":"The paper deals with the numerical validation, performance evaluation and robustness assessment of a procedure for the direct identification of passive transfer matrices based on convex programming. Validation is pursued by producing data sets from lumped multiport systems with random parameters (passive, non passive, and possibly affected by random noise), then evaluating the identification ability of the considered method. Results demonstrate how the considered approach satisfactorily covers the passive identification of a large class of data sets, even in presence of significant passivity violations or noise flawed data, at average accuracies comparable with non passive identifications obtained with standard Vector Fitting.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126374603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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