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2010 IEEE 14th Workshop on Signal Propagation on Interconnects最新文献

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Modeling the ion-exchange process to support the manufacturing of optical multimode graded-index waveguides in thin glass sheets 模拟离子交换过程，以支持在薄玻璃片中制造光学多模渐变折射率波导
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483566
T. Kuhler, E. Griese
{"title":"Modeling the ion-exchange process to support the manufacturing of optical multimode graded-index waveguides in thin glass sheets","authors":"T. Kuhler, E. Griese","doi":"10.1109/SPI.2010.5483566","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483566","url":null,"abstract":"Realizing electrical printed circuit boards with integrated optical interconnects for high bandwidth interconnects requires numerical models and algorithms for analyzing and optimising process parameters. In this paper an approach for the numerical computation of the refractive index profile of waveguides manufactored by ion-exchange processes is presented.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123937753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking 三维集成电路堆叠中垂直互连射频衬底耦合效应的表征与建模
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483585
E. Eid, T. Lacrevaz, C. Bermond, S. de Rivaz, S. Capraro, J. Roullard, L. Cadix, B. Fléchet, A. Farcy, P. Ancey, F. Calmon, O. Valorge, P. Leduc
{"title":"Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking","authors":"E. Eid, T. Lacrevaz, C. Bermond, S. de Rivaz, S. Capraro, J. Roullard, L. Cadix, B. Fléchet, A. Farcy, P. Ancey, F. Calmon, O. Valorge, P. Leduc","doi":"10.1109/SPI.2010.5483585","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483585","url":null,"abstract":"This paper discusses substrate coupling effects in 3D integrated circuits carried by TSV interconnects (Through Silicon Vias). These electrical couplings lead to several impacts on 3D circuit performance. RF (Radio Frequency) characterizations have been performed on dedicated test structures in order to extract electrical models of substrate coupling and make obvious this phenomenon. New modeling tools for predictive studies have been validated thanks to a good compatibility between RF measurements and RF models.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126018174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Virtual-EMI lab: Removing mysteries from black-magic to a successful front-end design 虚拟emi实验室:从黑魔法到成功的前端设计中去除奥秘
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483555
H. Fahmy, Chen Wang, D. Pissoort, A. Badesha
{"title":"Virtual-EMI lab: Removing mysteries from black-magic to a successful front-end design","authors":"H. Fahmy, Chen Wang, D. Pissoort, A. Badesha","doi":"10.1109/SPI.2010.5483555","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483555","url":null,"abstract":"EMI engineers are struggling everyday with complex radiation problems that fail critical products to pass EMI certification and causes big loss of profit. Advances in EMI engineering are following a similar trend like Signal-Integrity engineering 10-years ago when simulation tools became capable of providing accurate predictive simulations in a reasonable amount of time. With careful engineering utilizing cutting-edge full-wave field-solver software: Momentum (MOM) [1], EMpro (FDTD) [2] along with a hardware boost with heterogeneous massive CPU/GPU parallel processing (CUDA) technology [3], we can move the EMI teams from the back-end black-magic to a successful cost-effective front-end design. This paper presents an innovative process (Virtual-EMI lab) for pre- and post-tape-out providing the designers with an early stage EMI-suppression matrix (on-chip and onboard enablers) to find the optimum trade-off between performance and cost.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131551160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Generalization of the Barnes-Hut algorithm for rapid capacitance extraction in interconnects embedded in lossy multilayered media 有耗多层介质互连中快速电容提取的Barnes-Hut算法推广
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483581
K. Butt, J. Aronsson, V. Okhmatovski
{"title":"Generalization of the Barnes-Hut algorithm for rapid capacitance extraction in interconnects embedded in lossy multilayered media","authors":"K. Butt, J. Aronsson, V. Okhmatovski","doi":"10.1109/SPI.2010.5483581","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483581","url":null,"abstract":"The Barnes-Hut algorithm has been shown to be an effective acceleration scheme for rapid capacitance extraction in multi-layered substrates. In previous publications the algorithm was only applied to the interconnects embedded in the lossless dielectric layers. This paper discusses the Barnes-Hut's hierarchical center-of-charge approximation generalization for handle the capacitance extraction problem in lossy layered substrates.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130900128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Efficient evaluation of the frequency-dependent impedance matrix of full-package structures 全封装结构频率相关阻抗矩阵的有效评估
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483551
A. Chiariello, A. Girardi, C. Iorio, R. Izzi, T. Lessio, A. Maffucci, S. Ventre
{"title":"Efficient evaluation of the frequency-dependent impedance matrix of full-package structures","authors":"A. Chiariello, A. Girardi, C. Iorio, R. Izzi, T. Lessio, A. Maffucci, S. Ventre","doi":"10.1109/SPI.2010.5483551","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483551","url":null,"abstract":"The paper deals with the problem of the efficient extraction of the impedance matrix for a complex full-package structure. This result applies to ranges from DC to frequencies for which the skin effect is pronounced but the radiation and other full-wave effects are still negligible. The model identifies the impedance matrix by enforcing a physically consistent behavior to the resistance and reactance of the package in the low and high frequency limits. The identification is made by using only 5 frequency samples of the impedance matrix, which could be either given by measurements or numerical simulations. In this paper we have used a commercial 3D electromagnetic code (FastHenry) to provide the 5 starting points and the reference values to validate the procedure. Benchmark tests and case-studies are carried out, confirming the accuracy of the model.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125650727","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Adaptive time-domain macromodeling algorithm for fast termination of FDTD simulations 快速终止时域有限差分仿真的自适应时域宏建模算法
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483547
D. Deschrijver, D. Pissoort, T. Dhaene
{"title":"Adaptive time-domain macromodeling algorithm for fast termination of FDTD simulations","authors":"D. Deschrijver, D. Pissoort, T. Dhaene","doi":"10.1109/SPI.2010.5483547","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483547","url":null,"abstract":"In this paper, a novel adaptive stopping criterion for FDTD simulations of microwave components is applied to a package example. The new stopping criterion relies on the Vector Fitting algorithm to successively build an updated macromodel for the frequency response of the device under study based on increasing time-limited transient responses. In this way, it aims at minimizing the number of timesteps and, hence, the overall simulation time to capture the device's frequency response within a given frequency band up to a predefined accuracy level.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126400831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Evaluation the moisture effects on the performance of electronic devices 评价水分对电子设备性能的影响
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483575
F. Khoshnaw
{"title":"Evaluation the moisture effects on the performance of electronic devices","authors":"F. Khoshnaw","doi":"10.1109/SPI.2010.5483575","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483575","url":null,"abstract":"The moisture uptake has different effects on the performance of electronic components; besides electrochemical migration, moisture affects increasing the dielectric constant of electronic substrates, i.e. multichip module, printed circuit boards and hermetic packages, consequently this cause electrical failures and signal delay. This study explains the effects of moisture and air contaminates on the performance of electronic equipments.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"45 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113990573","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Response variability of high-speed interconnects via Hermite Polynomial Chaos 基于Hermite多项式混沌的高速互连响应变异性
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483597
I. Stievano, F. Canavero
{"title":"Response variability of high-speed interconnects via Hermite Polynomial Chaos","authors":"I. Stievano, F. Canavero","doi":"10.1109/SPI.2010.5483597","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483597","url":null,"abstract":"This paper focuses on the stochastic analysis of dynamical circuits via the Hermite Polynomial Chaos theory. The proposed approach facilitates the inclusion of external uncertainties, like tolerances or process variations, in the circuit analysis. The mechanics of the method amounts to expanding the output variables into a sum of a limited number of orthogonal basis functions and generating an extended matrix for the modified nodal analysis. The advocated method, while providing accurate results, turns out to be more efficient than the classical Monte Carlo technique in determining the circuit response sensitivity to parameters variability. A realistic application example involving a coupled-line structure concludes the paper.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124723949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
TSV-aware IDF-based power prediction for FPGA 基于tsv感知idf的FPGA功率预测
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483592
A. Atghiaee, N. Masoumi, Shohreh Rabiee
{"title":"TSV-aware IDF-based power prediction for FPGA","authors":"A. Atghiaee, N. Masoumi, Shohreh Rabiee","doi":"10.1109/SPI.2010.5483592","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483592","url":null,"abstract":"In this paper, we present a new power prediction method with application in regular structures such as FPGAs. We will mainly discuss the effects of through-silicon-via (TSV) and interconnects in order to offer a robust IDF-based solution for power prediction problem. In our survey, we will show that TSV increases the average wire-length by up to 16 percent that in turn leads to 16 percent elevation in power consumption as well. The 3D TSV effect in wire-length is mapped into a 2D wire-length distribution. The wire-length distribution benefits an accurate continuous stochastic function. There is no need for layout extracted data as to power prediction. The error of prediction is systematic and will also decrease as the circuit size increases.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123013460","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Network modeling of vertical signal interconnections in parallel reference plane structures on printed circuit boards 印刷电路板上平行参考平面结构中垂直信号互连的网络建模
2010 IEEE 14th Workshop on Signal Propagation on Interconnects Pub Date : 2010-05-09 DOI: 10.1109/SPI.2010.5483598
M. Friedrich, A. Mantzke, M. Leone
{"title":"Network modeling of vertical signal interconnections in parallel reference plane structures on printed circuit boards","authors":"M. Friedrich, A. Mantzke, M. Leone","doi":"10.1109/SPI.2010.5483598","DOIUrl":"https://doi.org/10.1109/SPI.2010.5483598","url":null,"abstract":"Signal path transitions through parallel reference plane structures on printed-circuit boards are investigated. The analysis is based on an equivalent circuit including the interconnect inductances, the signal source and load impedance. All required network elements can be calculated by simple formulas, including simple closed-form expressions for the self and mutual inductances in the central board region. Validation of the predicted network model by measurement shows a good agreement with respect to engineering purposes.","PeriodicalId":293987,"journal":{"name":"2010 IEEE 14th Workshop on Signal Propagation on Interconnects","volume":"259 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123734708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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