Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects最新文献_第3页

Analysis of PCB Discontinuities Using FD-TD and Wavelets 基于FD-TD和小波的PCB不连续分析

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258301

R. Araneo, S. Celozzi, S. Barmada, Marco Raugi

引用次数: 1

Signal Integrity Design for High-Performance, Low-Cost Interconnects and Optoelectronics 高性能、低成本互连和光电子学的信号完整性设计

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258275

J. Nickel, S. Crane, Myoung-soo Jeon, Ton Wang, Z. Horvath, Sangwook Lee, Andreas Cangellaris Cangellari

引用次数: 0

Non-Ideal Frequency Dependent Loss In Realistic PCB Transmission Lines 实际PCB传输线的非理想频率相关损耗

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258282

J. McCall, D. Shykind

引用次数: 4

Imperfect Return Path Effects on RLCG Model of Single and Coupled Interconnects: Propagation delay, Rise Time and Crosstalk Prediction 不完全返回路径对RLCG模型的影响:传播延迟、上升时间和串扰预测

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258279

J. Legier, E. Paleczny, K. Bouazzati, D. Deschachi, F. Huret

引用次数: 1

LFSR Test Pattern Crosstalk in Nanometer Technologies 纳米技术中LFSR测试模式串扰

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258315

D. Treytnar, M. Redeker, H. Grabinski, F. Ktata

引用次数: 1

Influence of the Cross Sectional Shape of Board-integrated Optical Waveguides on the Propagation Characteristics 板集成光波导截面形状对传输特性的影响

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258273

T. Bierhoff, Y. Sonmez, J. Schrage, A. Himmler, E. Griese, G. Mrozynski

引用次数: 7

S-Parameter Macromodels Incorporated into FDTD Simulation of Transmission Line Networks 输电线网络时域有限差分仿真中的s参数宏模型

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258270

I. Rumsey, G. Emili, M. Piket-May

{"title":"S-Parameter Macromodels Incorporated into FDTD Simulation of Transmission Line Networks","authors":"I. Rumsey, G. Emili, M. Piket-May","doi":"10.1109/SPI.2002.258270","DOIUrl":"https://doi.org/10.1109/SPI.2002.258270","url":null,"abstract":"The Finite Difference Time Domain (FDTD) method for the numerical solution of Maxwell’s equations is widely used for simulation of microwave and high speed digital circuits. Frequently, large scale circuit simulations include features whose electromagnetic behavior is desired to be found, interconnected by networks whose behavior is known a priori, either through measurement, simulation, or analytical models. If the known, “circuit-like” parts of the problem can be separated from the pertinent electromagnetic features and replaced by behavioral macromodels, computational savings a can be realized. The technique presented allows for these “circuit-like” components to be described by macromodels based on the S-parameters at their connection points and integrated into an FDTD simulation. This technique is applicable to a class of problems composed of a mixture of circuit and electromagnetic features, where the known behavior of the circuit features can be separated from the other electromagnetic interests. 1 Macromodeling Macromodeling is a common practice in circuit simulation, where a complex system is represented by a simplified model at its connection points. Logic circuits or operational amplifiers are frequently encountered examples of macromodels. Methods for extracting low-order models of complex systems is an active area of research which is being investigated by a number of researchers [1]. The method presented here uses established extraction techniques to derive transfer functions, and then seeks to plug those derived macromodels back into the FDTD method to enable system level simulation of large circuits.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114965644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Simulation and Measurement of Interconnect Structures for High Speed Digital Systems

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258305

M. Nisznansky, C. Ziegler, S. Martius, L. Schmidt, J.muller

引用次数: 0

Crosstalk and Delay Optimization via Neural Net-Based Topological Decomposition of 3D Interconnect 基于神经网络的三维互连拓扑分解串扰和延迟优化

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258298

A. Ilumoka, B. Kalla, V. Venkatraman

引用次数: 0

Field Theoretic Description of TEM-Waves on Lossless Multiconductor Transmission Lines 无损多导体传输线上tem波的场论描述

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258291

A. Reibiger

引用次数: 4