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Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects最新文献

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Simulation of Reduction Properties of Radiated Emission by On-chip Decoupling Capacitor 片上去耦电容对辐射发射抑制特性的模拟
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258278
T. Sudo, M. Bonkohara
{"title":"Simulation of Reduction Properties of Radiated Emission by On-chip Decoupling Capacitor","authors":"T. Sudo, M. Bonkohara","doi":"10.1109/SPI.2002.258278","DOIUrl":"https://doi.org/10.1109/SPI.2002.258278","url":null,"abstract":"This paper reports simulation results on simultaneous switching noise and radiated emission due to the existence of on-chip decoupling capacitor. Signal overshoots/undershoots was observed for the case of on-chip decoupling capacitor, while signal degradation was observed for the case of without on-chip decoupling capacitor. The behavior of ground bounce for the case of on-chip capacitor was different from the case of without on-chip capacitor. The current flow at the power and ground terminals was used as excitation source of FDTD model with the power/ ground plane. The simulation results were compared with the measurement data.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126872410","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Unit-Cell Modeling of High-Speed Interconnect with Adjacent Metal-Filled Via Array using FDTD method 基于FDTD的相邻金属填充过孔阵列高速互连单元格建模
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258271
Heeseok Lee, C. Park, D. Kam, Joungho Kim
{"title":"Unit-Cell Modeling of High-Speed Interconnect with Adjacent Metal-Filled Via Array using FDTD method","authors":"Heeseok Lee, C. Park, D. Kam, Joungho Kim","doi":"10.1109/SPI.2002.258271","DOIUrl":"https://doi.org/10.1109/SPI.2002.258271","url":null,"abstract":"The periodic structure modeling technique is employed to investigate the transmission line characteristic of the stripline with adjacent metal-filled via-array (SAMVA). The unit-cell modeling (UCM) using the finite-difference time-domain (FDTD) method was utilized to determine the full-wave effect on the propagation property of the high speed interconnecting structure defined by longitudinally periodic boundary condition in package and board level. UCM is the efficient modeling methodology for the periodic transmission line structure. Specifically, the slow wave effect of SAMVA will be discussed.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129729083","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effects of the Dispersive Behavior of Dielectric Substrates on the SPI 介电基材色散特性对SPI的影响
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258294
R. Araneo, S. Celozzi, F. Maradei
{"title":"Effects of the Dispersive Behavior of Dielectric Substrates on the SPI","authors":"R. Araneo, S. Celozzi, F. Maradei","doi":"10.1109/SPI.2002.258294","DOIUrl":"https://doi.org/10.1109/SPI.2002.258294","url":null,"abstract":"Actual printed circuit board configurations require either full-wave simulations or accurate analytical techniques for the analysis and the design of interconnects. This paper focuses on the effects of the dispersive behavior of dielectric substrates and on their simulation by means of new expressions giving a guidance on effective permittivity and per unit length (p.u.l.) parameters at the design stage.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129595448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A numerical tool for the analysis of the effects of conductor losses on interconnect structures 用于分析导体损耗对互连结构影响的数值工具
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258293
A. Maffucci, G. Miano, G. Rubinacci, F. Villone
{"title":"A numerical tool for the analysis of the effects of conductor losses on interconnect structures","authors":"A. Maffucci, G. Miano, G. Rubinacci, F. Villone","doi":"10.1109/SPI.2002.258293","DOIUrl":"https://doi.org/10.1109/SPI.2002.258293","url":null,"abstract":"","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114742680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An Evaluation of Differential Impedance in PCBs Using Two Single-Ended Probes Only 仅用两个单端探头评估pcb中的差分阻抗
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258307
D. Kam, Heeseok Lee, Woonghwan Ryu, Jonghoon J. Kim, Bongcheol Park, Joungho Kim
{"title":"An Evaluation of Differential Impedance in PCBs Using Two Single-Ended Probes Only","authors":"D. Kam, Heeseok Lee, Woonghwan Ryu, Jonghoon J. Kim, Bongcheol Park, Joungho Kim","doi":"10.1109/SPI.2002.258307","DOIUrl":"https://doi.org/10.1109/SPI.2002.258307","url":null,"abstract":"There is an emerging need to measure differential transmission lines in printed circuit boards (PCBs). However, conventional measurement techniques are not simple because they require broadband baluns or matched termination. In this paper, we suggest a simple measurement technique using two coaxial probes only. To validate the method, coupled microstrip lines were tested. The results show very good agreement with those from the conventional methods. The rationale of this method is also clearly stated. Finally, it is reconfirmed by the full-wave simulation.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116022742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Simulation of Eye-Diagrams on Lossy Transmission Lines using Extracted Data from 1-port TDR Measurements 利用单端口TDR测量提取数据模拟有损传输线上的眼图
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258266
Woopoung Kim, Seock-Hee Lee, M. Swaminathan, R. Tummala
{"title":"Simulation of Eye-Diagrams on Lossy Transmission Lines using Extracted Data from 1-port TDR Measurements","authors":"Woopoung Kim, Seock-Hee Lee, M. Swaminathan, R. Tummala","doi":"10.1109/SPI.2002.258266","DOIUrl":"https://doi.org/10.1109/SPI.2002.258266","url":null,"abstract":"The propagation constant and characteristic impedance of transmission lines were measured from 1port TDR measurements. Using the extracted data, eyediagrams of lossy transmission lines were simulated based on a non-physical RLGC model. Conventional W element simulation for the lossy transmission lines were performed in Hspice for comparison with the non-physical RLGC model. The eye-diagram of the non-physical RLGC model showed more loss, as is expected in lossy transmission lines.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129499545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Direct Measures of Path Delays on Commercial FPGA Chips 商用FPGA芯片上路径延迟的直接测量
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258304
Mattia Ruffoni, A. Bogliolo
{"title":"Direct Measures of Path Delays on Commercial FPGA Chips","authors":"Mattia Ruffoni, A. Bogliolo","doi":"10.1109/SPI.2002.258304","DOIUrl":"https://doi.org/10.1109/SPI.2002.258304","url":null,"abstract":"We present a general technique for measuring the propagation delay on the internal wires of FPGA chips. The measure is based on the comparison between the operating frequencies of two ring oscillators that differ only for the structure under test, that is included (or not) in the loop. Experimental results are presented for a device of the Xilinx XC4000 family.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130354486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Impact of Low-K Intra-layer Dielectrics on Integration 低k层内介电体对集成的影响
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258310
D. Deschacht, F. Huret
{"title":"Impact of Low-K Intra-layer Dielectrics on Integration","authors":"D. Deschacht, F. Huret","doi":"10.1109/SPI.2002.258310","DOIUrl":"https://doi.org/10.1109/SPI.2002.258310","url":null,"abstract":"In deep sub-micron technologies, capacities of coupling between lines can reach values where one cannot ignore the amplitude of the noise due to this coupling. In this paper we highlight the impact of the use of various dielectric materials, to reduce the coupling capacitances, and we will study its impact on crosstalk reduction. From an analytic expression for crosstalk evaluation, one can predict that using a low-k dielectric equal to two one can reduce the crosstalk voltage by about 25%, which can be employed on a possible reduction of the space between lines.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114309014","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study of copper diffusion into tantalum nitride (Ta/sub 2/N) by rapid thermal annealing (RTA) 快速热退火(RTA)对铜向氮化钽(Ta/sub 2/N)扩散的研究
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258309
S. Loh, D. Zhang, R. Liu, C. Li, A. S. Wee
{"title":"Study of copper diffusion into tantalum nitride (Ta/sub 2/N) by rapid thermal annealing (RTA)","authors":"S. Loh, D. Zhang, R. Liu, C. Li, A. S. Wee","doi":"10.1109/SPI.2002.258309","DOIUrl":"https://doi.org/10.1109/SPI.2002.258309","url":null,"abstract":"We have carried out direct diffusion measurements of Cu into Ta2N. Thin films of 50nm thickness of Cu were grown onto a thick Ta2N layer of 1µm deposited by Ionized Metal Plasma (IMP). Samples were annealed in a rapid thermal system from temperatures ranging from 400°C to 750°C for periods of 180s. Results based on sheet resistance measurements, x-ray diffraction analyses, atomic force microscopy measurements and secondary ion mass spectroscopy analyses consistently follow a transformation of amorphous Ta2N to a crystalline phase and finally forming Cu-Ta-O compounds at higher annealing temperatures. The copper and tantalum nitride diffusion profile was performed using Secondary Ion Mass Spectroscopy. The Cu diffusion coefficients in Ta2N can be described by 1.5778 × 10 -12 exp (-0.4066 eV/kT) cm 2 /s. To assure reliability, the extent of both diffusions should be considered in device design and processing.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"287 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117203462","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An EMI Simulator Based on the Parallel-Distributed FDTD Method for Large-Scale Printed Wiring Boards 基于并行分布时域有限差分法的大型印制板电磁干扰模拟器
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258300
H. Asai, Takayuki Watanabe, Tohru Sasaki, K. Araki
{"title":"An EMI Simulator Based on the Parallel-Distributed FDTD Method for Large-Scale Printed Wiring Boards","authors":"H. Asai, Takayuki Watanabe, Tohru Sasaki, K. Araki","doi":"10.1109/SPI.2002.258300","DOIUrl":"https://doi.org/10.1109/SPI.2002.258300","url":null,"abstract":"This paper describes a full-wave EMI (electromagnetic in- terference) simulator for the new methodology of printed wir- ing board (PWB) design with the consideration of electromag- netic compatibility (EMC) and signal integrity (SI). This simu- lator is based on the parallel-distributed finite-difference time- domain (FDTD) method, and works on the PC-cluster. Using our simulator, the full-wave analysis of the large-scale PWB of a real product can be performed within the reasonable time. Therefore, it is possible to improve the efficiency of the PWB design by using the full-board simulation at each step of the design flows.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130593776","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
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