{"title":"介电基材色散特性对SPI的影响","authors":"R. Araneo, S. Celozzi, F. Maradei","doi":"10.1109/SPI.2002.258294","DOIUrl":null,"url":null,"abstract":"Actual printed circuit board configurations require either full-wave simulations or accurate analytical techniques for the analysis and the design of interconnects. This paper focuses on the effects of the dispersive behavior of dielectric substrates and on their simulation by means of new expressions giving a guidance on effective permittivity and per unit length (p.u.l.) parameters at the design stage.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Effects of the Dispersive Behavior of Dielectric Substrates on the SPI\",\"authors\":\"R. Araneo, S. Celozzi, F. Maradei\",\"doi\":\"10.1109/SPI.2002.258294\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Actual printed circuit board configurations require either full-wave simulations or accurate analytical techniques for the analysis and the design of interconnects. This paper focuses on the effects of the dispersive behavior of dielectric substrates and on their simulation by means of new expressions giving a guidance on effective permittivity and per unit length (p.u.l.) parameters at the design stage.\",\"PeriodicalId\":290013,\"journal\":{\"name\":\"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-05-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2002.258294\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2002.258294","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effects of the Dispersive Behavior of Dielectric Substrates on the SPI
Actual printed circuit board configurations require either full-wave simulations or accurate analytical techniques for the analysis and the design of interconnects. This paper focuses on the effects of the dispersive behavior of dielectric substrates and on their simulation by means of new expressions giving a guidance on effective permittivity and per unit length (p.u.l.) parameters at the design stage.
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