Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects最新文献

S Matrix versus ABCD Chain Matrix Formulation in Probe-tip Calibrations S矩阵与ABCD链矩阵公式在探针尖端校准中的比较

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258306

J. Grzyb, G. Troster

{"title":"S Matrix versus ABCD Chain Matrix Formulation in Probe-tip Calibrations","authors":"J. Grzyb, G. Troster","doi":"10.1109/SPI.2002.258306","DOIUrl":"https://doi.org/10.1109/SPI.2002.258306","url":null,"abstract":"We present some advantageous features of the chain ABCD matrix formulation in comparison with S-matrix formulation in characteristic impedance extraction with probetip calibrations. The procedure is based on the known measurement technique of two different on-wafer line standards [1]. An initial off-wafer LRM or TRL calibration with standard calibration substrate is assumed. The first feature is the formulation of the whole extraction problem in terms of the ABCD chain matrix. It allows us to omit one of the limitations of the true traveling waves based Smatrix [3] asymmetry of a general reciprocal transition between two different waveguides, in particular probe-tip-line junction. This limitation is a difference between complex characteristic impedances of both waveguides. On the contrary, the symmetry of its admittance matrix or equivalently the determinant AD-BC of its chain matrix is not influenced by this effect. If one models the probe-tip-line transition by use of only a shunt admittance or cascade of a shunt admittance and a series impedance, the A element of chain matrix is not influenced by these parasitics and is equal to one. This allows immediate characteristic impedance extraction without analyzing any of these transition models. Moreover, one is able to choose the valid model and verify if any of the possible equivalent parasitic elements can be neglected. The next feature is that the chain matrix formulation modified in a specific way allows the extraction of the equivalent position of the reference planes at the probe-tips. Equivalent means that their locations are equal to their physical locations in case of negligible influence of the series parasitic impedance (usually parasitic inductance). This is very interesting property if we take into consideration that the exact position of the probe tips and reference planes are not known. The last feature allows us to extract the characteristic impedance of the lines without modeling the transition structure under assumption that the condition A=D of its chain ABCD matrix (the model of a reciprocal structure is symmetric) is approximated with good accuracy. Such a formulation takes automatically into consideration even a distributed nature of the transition, which can be of importance at mm-wave frequencies. All the equivalent elements values of the models are extracted from analytical equations for every frequency point. Thus their frequency behavior can be investigated and possible validity of the model (constant equivalent element values) proved. I General Waveguide Theory With the increasing use of planar transmission lines, junctions between waveguides supporting lossy hybrid modes have become common. In this case the classical microwave circuit theories fail. The classical waveguide theory fails to","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126962674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Crosstalk Analysis for High-Speed Pulse Propagation on Frequency-Dependent Lossy Electrical Interconnections 频率相关损耗电互连中高速脉冲传播的串扰分析

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258267

T. Zhou, S. Dvorak, J. Prince

引用次数: 0

Deembeding of the Taper-fed CPW and Microstrip Lines Characteristic Impedance with Probe-tip Calibrations 锥形馈电CPW和微带线特性阻抗的探针尖校准解嵌

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258288

J. Grzyb, G. Tröster

{"title":"Deembeding of the Taper-fed CPW and Microstrip Lines Characteristic Impedance with Probe-tip Calibrations","authors":"J. Grzyb, G. Tröster","doi":"10.1109/SPI.2002.258288","DOIUrl":"https://doi.org/10.1109/SPI.2002.258288","url":null,"abstract":"A procedure allowing systematic determination of the characteristic impedance of the taper-fed CPW and microstrip lines and deembedding the influence of the feeding discontinuities is presented. The procedure is based on the measurement technique of two different on-wafer line standards. An initial off-wafer LRM or TRL calibration with standard calibration substrate is assumed. The feeding structure consists of a coplanar pad configuration suited for probe-tip feeding and via-based or taper-based transitions to microstrip or CPW configurations, respectively. The procedure consists of two steps. In the first step the probe–tip discontinuity only is deembedded. For this purpose we use our new chain matrix formulated calibration comparison technique based on the measurements of two on-wafer CPW line standards of the same geometry as the feeding pads. Our onwafer CPW standards stay the same for all measured microstrip lines. This allows to perform only one probe-tip deembeding valid for all of the measured microstrip lines. The second step is deembeding of the CPW-microstrip line or CPW-taper-CPW transition and determination of the characteristic impedance of measured lines. The first novelty is the formulation of the whole extraction problem in terms of the ABCD chain matrix. It allows us to omit one of the limitations of the true traveling waves based S-matrix [3] asymmetry of the general CPW-microstrip line and CPWtaper-CPW transitions. This limitation is a difference between complex characteristic impedances of CPW and microstrip or different CPW lines. On the contrary, the symmetry of its admittance matrix or equivalently the determinant AD-BC of its chain matrix is not influenced by this effect. The next novelty lies in the modeling of these transitions. We assume that it can be approximated by a symmetric model. Its chain matrix fulfills the condition A=D. This, in turn, allows to extract the characteristic impedance of the lines based on two line measurements without using of any fixed transition model. Such a formulation takes automatically into consideration even a distributed nature of the transition, which can be of importance at mm-wave frequencies. The complex propagation constants and characteristic impedance of wide CPW lines on fused silica substrate exceeding the pitch of the probes have been determined from the measurements. We have also analyzed the extraction procedure of different CPWmicrostrip geometries on GaAs and MCM-D substrates up to 70GHz. We have compared different transition models: simple series inductance, cascade of parallel capacitance and series inductance, cascade of series inductance and parallel capacitance and our box model with its chain matrix fulfilling the condition A=D. The latter model outperforms the others, esp. at higher mm-wave frequencies. We have also investigated different topologies of the transition for MCM-D to find the optimum one. The best extraction accuracy can be achieved if the microstrip ","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"251 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114353877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Modeling Of Electromagnetic Waves Incident On Integrated Circuit 入射到集成电路中的电磁波建模

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258292

W. Bandurski

引用次数: 0

Modeling of On-Chip Transmission Lines in High-Speed A&MS Design - The Low Frequency Inductance Calculation 高速A&MS设计中片上传输线的建模-低频电感计算

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258319

R. Gordin, D. Goren, M. Zelikson

引用次数: 9

Charge-based on-chip measurement technique for the selective extraction of cross-coupling capacitances 选择性提取交叉耦合电容的基于电荷的片上测量技术

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258287

A. Bogliolo, L. Vendrame, L. Bortesi, Ezio Barachetti

引用次数: 14

New Framework for Passive Macromodeling of High-Speed Distributed Transmission Line Subnetworks 高速分布式传输线子网被动宏观建模新框架

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258284

A. Dounavis, R. Achar, M. Nakhla

{"title":"New Framework for Passive Macromodeling of High-Speed Distributed Transmission Line Subnetworks","authors":"A. Dounavis, R. Achar, M. Nakhla","doi":"10.1109/SPI.2002.258284","DOIUrl":"https://doi.org/10.1109/SPI.2002.258284","url":null,"abstract":"A new framework for passive macromodeling of multiport distributed interconnects is presented in this paper. The proposed framework provides for efficient treatment of various categories of distributed interconnects, such as lossless transmission lines, on-chip RC distributed transmission lines, transmission lines with constant RLCG parameters, transmission lines (TLs) with frequency-dependent RLCG parameters etc. The proposed methodology is based on closed-form matrix-rational approximation of exponential functions describing Telegrapher’s equations and enables the development of the transmission line macromodel to be formulated analytically in terms of known (stored) constants and given perunit-length parameters. The proposed framework can be easily incorporated with conventional circuit simulators such as SPICE and also with the recently developed passive modelreduction techniques. I. INTRODUCTION The rapid increase in operating speeds, density and complexity of modern integrated circuits has made interconnect analysis a requirement for all state-of-the-art circuit simulators. Interconnect effects such as ringing, signal delay, distortion, attenuation and crosstalk can severely degrade signal integrity. Interconnections can be from various levels of design hierarchy, such as on-chip, packaging structures, MCMs, PCBs and backplanes. As the frequency of operation increases, the interconnect lengths become a significant fraction of the operating wavelength, and conventional lumped models become inadequate in describing the interconnect performance and transmission line models become necessary. Skin and proximity effects also become prominent at high frequencies and distributed models with frequency-dependent parameters may be needed. The major difficulty usually encountered while linking the distributed transmission line models and nonlinear simulators is the problem of mixed frequency/time [1], [2]. This is because distributed elements are usually characterized in the frequency-domain whereas nonlinear components such as drivers and receivers are represented only in time-domain. Several publications can be found in the literature, which address this issue. Approaches based on conventional lumped segmentation of transmission lines provide a brute force solution to the problem of mixed frequency/time simulation. However, these methods lead to large circuit matrices, rendering the simulation inefficient. In this paper, a new framework for passive macromodeling of multiport distributed interconnects is presented. The proposed framework provides for efficient treatment of various categories of distributed interconnects, such as lossless transmission lines, on-chip RC distributed transmission lines, transmission lines with constant RLCG parameters, transmission lines with frequency-dependent RLCG parameters etc. The proposed methodology is based on closed-form matrixrational approximation of exponential functions describing Telegrapher’s equations [4]","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121475742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The Improvement of Signal Integrity (SI) according to The Location of Via in The Vicinity of A Slot in The Reference Plane 参考平面槽附近通孔位置对信号完整性的改善

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258311

Tae-Jin Lee, Junho Kim, Hyungsoo Kim, Piljung Jun, Joungho Kim

引用次数: 6

Estimation of the Interconnect Jitter Performance by Frequency Domain Behaviour 基于频域行为的互连抖动性能估计

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258318

A. Tanskanen

引用次数: 1

Fast Simulation of Interconnect Structures Using Adaptive Integral Method (AIM) 基于自适应积分法的互连结构快速仿真

Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258269

V. Okhmatovski, A. Cangellaris

{"title":"Fast Simulation of Interconnect Structures Using Adaptive Integral Method (AIM)","authors":"V. Okhmatovski, A. Cangellaris","doi":"10.1109/SPI.2002.258269","DOIUrl":"https://doi.org/10.1109/SPI.2002.258269","url":null,"abstract":"A full-wave technique is developed for fast analysis of high-frequency planar interconnects and microwave circuits. The proposed methodology is an extension of the adaptive integral method to the objects enclosed in a rectangular box with perfect electrically conducting walls. It can be used for simulation of both shielded and open structures. The only limiting condition for the open circuit analysis is that the substrate is to be electrically thin in the frequency range of interest. The advantage of the proposed method compared to the FFT based techniques adopted in the commercial tools such as Sonnet EM simulator is in the adaptive scheme allowing efficient FFT use for the circuits not fitting onto the FFT grids. The computational time per iteration and memory usage for the solver scale as (l og ) ON N and () ON respectively, where N is the number of unknowns in the discrete model. The accuracy and efficiency of the solver is demonstrated through its application to the modeling of a microwave filter. I. Introduction The growth of operating frequencies and on-board dense packaging make full electromagnetic simulation an essential part of modern high-frequency design. Under these conditions, traditional design schemes, based on the decomposition of the system into smaller components with independent analysis of each component, provides inadequate accuracy due to the strong near field coupling. Attempts to simulate systems without such a decomposition, however, often times result in the prohibitively large size of the discrete problem requiring CPU and memory resources unavailable to most designers. This situation motivates the development of new fast algorithms capable of accurate simulation of large scale problems using moderate computational resources. In this paper we discuss one such algorithm built specifically for the analysis of dense open integrated circuits. The presented technique is a modification of the adaptive integral method [1] for the case when the circuit is situated within a rectangular waveguide with proper termination loads. The presence of the perfectly conducting walls forming the guide is brought into the analysis by modeling of the circuit port excitation using a delta-gap voltage generator [2]. Such implementation of AIM for the shielded circuits exhibits specific features because of the modal structure of the electromagnetic field excited in the waveguide and is discussed in this paper. The new AIM algorithm has proven to be in the same order of complexity as its open media counterpart where computational time per iteration scales as (l og ) ON N instead of 2","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123767686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0