{"title":"高速A&MS设计中片上传输线的建模-低频电感计算","authors":"R. Gordin, D. Goren, M. Zelikson","doi":"10.1109/SPI.2002.258319","DOIUrl":null,"url":null,"abstract":"In this paper, we present a generic procedure for creating accurate and efficient expressions for calculating the low frequency inductance of on-chip transmission lines. The modeling of the inductance is an integral part of interconnect-aware A&MS design methodology, enabling high predictability of the critical interconnect behavior. The calculation procedure is based on the average geometrical distances approach and it yields the results having the accuracy within 1% vs. EM solver.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Modeling of On-Chip Transmission Lines in High-Speed A&MS Design - The Low Frequency Inductance Calculation\",\"authors\":\"R. Gordin, D. Goren, M. Zelikson\",\"doi\":\"10.1109/SPI.2002.258319\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we present a generic procedure for creating accurate and efficient expressions for calculating the low frequency inductance of on-chip transmission lines. The modeling of the inductance is an integral part of interconnect-aware A&MS design methodology, enabling high predictability of the critical interconnect behavior. The calculation procedure is based on the average geometrical distances approach and it yields the results having the accuracy within 1% vs. EM solver.\",\"PeriodicalId\":290013,\"journal\":{\"name\":\"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects\",\"volume\":\"47 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-05-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2002.258319\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2002.258319","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling of On-Chip Transmission Lines in High-Speed A&MS Design - The Low Frequency Inductance Calculation
In this paper, we present a generic procedure for creating accurate and efficient expressions for calculating the low frequency inductance of on-chip transmission lines. The modeling of the inductance is an integral part of interconnect-aware A&MS design methodology, enabling high predictability of the critical interconnect behavior. The calculation procedure is based on the average geometrical distances approach and it yields the results having the accuracy within 1% vs. EM solver.
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