{"title":"入射到集成电路中的电磁波建模","authors":"W. Bandurski","doi":"10.1109/SPI.2002.258292","DOIUrl":null,"url":null,"abstract":"Electromagnetic field coupling to integrated circuit is considered. Integrated circuit (IC) is modeled as a lossy fourlayer structure. Basing on the concept of the transmission line analogy, analytical expressions for electric field components on the surface and inside of IC structure has been derived. Obtained formulas permits for time-domain and simulation in SPICE. Simple example illustrates that approach.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modeling Of Electromagnetic Waves Incident On Integrated Circuit\",\"authors\":\"W. Bandurski\",\"doi\":\"10.1109/SPI.2002.258292\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electromagnetic field coupling to integrated circuit is considered. Integrated circuit (IC) is modeled as a lossy fourlayer structure. Basing on the concept of the transmission line analogy, analytical expressions for electric field components on the surface and inside of IC structure has been derived. Obtained formulas permits for time-domain and simulation in SPICE. Simple example illustrates that approach.\",\"PeriodicalId\":290013,\"journal\":{\"name\":\"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-05-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2002.258292\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2002.258292","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling Of Electromagnetic Waves Incident On Integrated Circuit
Electromagnetic field coupling to integrated circuit is considered. Integrated circuit (IC) is modeled as a lossy fourlayer structure. Basing on the concept of the transmission line analogy, analytical expressions for electric field components on the surface and inside of IC structure has been derived. Obtained formulas permits for time-domain and simulation in SPICE. Simple example illustrates that approach.
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