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Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects最新文献

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Partial Inductance Extraction with an Exponentially Damped Potential Compared to Virtual Screening 指数阻尼电位的部分电感提取与虚拟筛选的比较
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258268
A. J. Dammers, N.p. Der Meijs
{"title":"Partial Inductance Extraction with an Exponentially Damped Potential Compared to Virtual Screening","authors":"A. J. Dammers, N.p. Der Meijs","doi":"10.1109/SPI.2002.258268","DOIUrl":"https://doi.org/10.1109/SPI.2002.258268","url":null,"abstract":"In order to improve the e‐ciency of the PEEC method for large scale interconnect inductance extraction, enhancing robustness under matrix truncation is of vital importance. We establish the relationship between the virtual screening approach of Dammers and van der Meijs (ICCAD’99) and the damped potential method of Beattie and Pileggi (DAC’01). Each of these methods is characterized by a single parameter, a virtual screening radius r0 and a damping constant fi respectively. We show theoretically and experimentally that asymptotically, for small and large d, where d is the distance between a conductor and a return conductor, the results of both methods are identical when the damping constant is identifled as fi … 1:123 =r0. Moreover, we show that virtual screening behaves better in the intermediate regime d » r0 and that computation of matrix elements is more e‐cient.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129147166","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Slot Transmission Line Model of Interconnections Crossing Split Power/Ground Plane on High-speed Multi-layer Board 高速多层板上跨分路电源/地平面互连的槽位传输线模型
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258281
Jingook Kim, Hyungsoo Kim, Y. Jeong, Junho Lee, Joungho Kim
{"title":"Slot Transmission Line Model of Interconnections Crossing Split Power/Ground Plane on High-speed Multi-layer Board","authors":"Jingook Kim, Hyungsoo Kim, Y. Jeong, Junho Lee, Joungho Kim","doi":"10.1109/SPI.2002.258281","DOIUrl":"https://doi.org/10.1109/SPI.2002.258281","url":null,"abstract":"In the design of high-speed multi-layer board, the partitioning of the power/ground plane breaks return path of the signal current through either power plane or ground plane, which causes unwanted side effects such as reflection, crosstalk and radiation. In this paper, we have analyzed the effects of split power/ground plane on signal integrity experimentally and numerically. We have proposed equivalent circuit model of the signal traces crossing the ground slot, based on slot transmission line model. The reflection, transmission and crosstalk waveforms can be simulated and explained rigorously using the proposed model, regardless of the type of slot end.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122083074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Dealing with noise margins in high-speed voltage-mode signaling 处理高速电压模式信号中的噪声边界
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258297
A. Bogliolo, P. Olivo
{"title":"Dealing with noise margins in high-speed voltage-mode signaling","authors":"A. Bogliolo, P. Olivo","doi":"10.1109/SPI.2002.258297","DOIUrl":"https://doi.org/10.1109/SPI.2002.258297","url":null,"abstract":"","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125981539","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Design Guidelines of Spread Spectrum Clock for Suppression of Radiation and Interference from High-speed Interconnection Line 抑制高速互连线路辐射和干扰扩频时钟设计导则
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258312
Jonghoon J. Kim, Piljung Jun, Jung-gun Byun, Joungho Kim
{"title":"Design Guidelines of Spread Spectrum Clock for Suppression of Radiation and Interference from High-speed Interconnection Line","authors":"Jonghoon J. Kim, Piljung Jun, Jung-gun Byun, Joungho Kim","doi":"10.1109/SPI.2002.258312","DOIUrl":"https://doi.org/10.1109/SPI.2002.258312","url":null,"abstract":"In the modern digital systems, the most amount of the radiation from the system is caused by the high-speed clock signal. As a method to reduce the radiated emission from the system clock, the spread spectrum clock technique that modulates the system clock frequency had been introduced. In this paper, we introduce the design guidelines of the spread spectrum clock for the suppression of electromagnetic radiation and interference from the high-speed digital interconnection line. We propose some formulas for the attenuation of maximum spectrum at odd harmonics of the spread spectrum clock with the triangular modulation profile using FFT algorithm. The formulas include jitter and peak deviation as well as fundamental and modulation frequencies. We expect that these formulas are helpful to designers who adopt the spread spectrum clock technique to suppress the electromagnetic radiation and interference from the highspeed digital interconnection line.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123683299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Comparison of Optical and Electrical Interconnects for Intrachip Communications 芯片内通信的光电互连比较
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258274
F. Sellaye, F. Caignet, J. Collet
{"title":"Comparison of Optical and Electrical Interconnects for Intrachip Communications","authors":"F. Sellaye, F. Caignet, J. Collet","doi":"10.1109/SPI.2002.258274","DOIUrl":"https://doi.org/10.1109/SPI.2002.258274","url":null,"abstract":"We simulated and compared optical and electrical interconnects for intrachip communications, focusing particularly on the dependence of the power consump tion versus the interconnect length and the transmis sion throughput. We conclude that optoelectronic interconnects today consume less energy when the interconnect length is (typically) longer than (23) mm. The competition is clearly open in the future. Optical interconnects might contribute to solve onchip power consump tion and crosstalk issues, provided that their technology becomes cheap, compatible with the CMOS processes, and that it will be possible to reduce the threshold current of the VCSEL emitters down to a few μAmps.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127085831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Organic Chip Packaging Technology For High Speed Processor Applications 用于高速处理器的有机芯片封装技术
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258316
B. Garben, A. Huber, D. Kaller, E. Klink
{"title":"Organic Chip Packaging Technology For High Speed Processor Applications","authors":"B. Garben, A. Huber, D. Kaller, E. Klink","doi":"10.1109/SPI.2002.258316","DOIUrl":"https://doi.org/10.1109/SPI.2002.258316","url":null,"abstract":"The high dense interconnect (HDI) organic chip packaging technology has made rapid development advancements in the last few years. Due to the high dense wiring structures in the build up layers and newly also in the laminated core, high signal I/O applications and dense chip area array footprints can be supported. In the present paper the electrical characteristics of the HDI organic chip packaging technology are described with regard to signal and power integrity. In addition different applications for single-chip and multi-chip modules are discussed","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124009088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Efficient Frequency-Domain Simulation of Arbitrary Nonuniform Lossy Coupled Interconnects 任意非均匀有损耦合互连的有效频域仿真
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258303
R. Araneo
{"title":"Efficient Frequency-Domain Simulation of Arbitrary Nonuniform Lossy Coupled Interconnects","authors":"R. Araneo","doi":"10.1109/SPI.2002.258303","DOIUrl":"https://doi.org/10.1109/SPI.2002.258303","url":null,"abstract":"An efficient frequency-domain method for the analysis of arbitrary nonuniform lossy coupled multiconductor transmission lines and interconnects is presented and investigated. The proposed approach permits to handle any non-uniformity with excellent accuracy and efficiency. Examples and comparisons with simulated full-wave results are given to illustrate the high suitability of the approach in modeling arbitrary lines and interconnects.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114096543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation of Metal-Organic Chemical Vapor Deposited Copper Diffusion in Tantalum after Annealing 金属-有机化学气相沉积铜在钽中退火后扩散的研究
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258308
S. Loh, D. Zhang, R. Liu, C. Li, A. S. Wee
{"title":"Investigation of Metal-Organic Chemical Vapor Deposited Copper Diffusion in Tantalum after Annealing","authors":"S. Loh, D. Zhang, R. Liu, C. Li, A. S. Wee","doi":"10.1109/SPI.2002.258308","DOIUrl":"https://doi.org/10.1109/SPI.2002.258308","url":null,"abstract":"We have carried out direct diffusion measurements of metal organic chemical vapor deposition (MOCVD) Cu into Ta and Ta into cvd Cu. Copper films deposited by MOCVD technique of 500nm thickness were grown onto a thick Ta layer of 1µm deposited by Ionized Metal Plasma (IMP). Samples were annealed in a furnace system from temperatures ranging from 300°C to 550°C for periods of ½ an hour. The electrical and mechanical properties of the structures were examined by experiments such as sheet resistance, atomic force microscopy (AFM), scanning electron microscopy (SEM), and x-ray diffraction (XRD). The diffusion profile was performed using Secondary ion mass spectroscopy (SIMS). The Cu diffusion coefficient in Ta can be described by 2.845 × 10 -14 exp (-0.1452eV/kT) cm 2 /s while the Ta diffusion coefficient in Cu can be described by 1.3417 × 10 -13","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129831950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
On the Modeling of Packages from Their Time Responses 从时间响应看包裹建模
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258285
F. Canavero, S. Grivet-Talocia, H. Kruger, I. Maio, I. Stievano, P. Thoma
{"title":"On the Modeling of Packages from Their Time Responses","authors":"F. Canavero, S. Grivet-Talocia, H. Kruger, I. Maio, I. Stievano, P. Thoma","doi":"10.1109/SPI.2002.258285","DOIUrl":"https://doi.org/10.1109/SPI.2002.258285","url":null,"abstract":"We address the modeling of packages by the estimation of their poles from time responses. Such an approach is suitable for structures with many terminals and can produce low-order very accurate models. A real-world modeling example is used for illustration. Nowadays, macromodels describing the components of mod- ern interconnection systems and enabling their simulation by means of standard circuit simulators are attracting growing in- terest. The macromodeling approach, in fact, offers both high efficiency and accuracy. It splits the simulation problem into two separate stages: higher order effects taking place inside components are handled during the development of macromod- els; the system behavior is then obtained by simulating an elec- trical network of reduced complexity that reproduces the behav- ior of the original components. In this paper, we deal with the development of macromod- els for linear packages from their measured or simulated (e.g., via a fullwave solver) responses. From a formal point of view,","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130031439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A filter representation for reduced order models 降阶模型的过滤器表示形式
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects Pub Date : 2002-05-12 DOI: 10.1109/SPI.2002.258302
P. Heres, W. Schilders
{"title":"A filter representation for reduced order models","authors":"P. Heres, W. Schilders","doi":"10.1109/SPI.2002.258302","DOIUrl":"https://doi.org/10.1109/SPI.2002.258302","url":null,"abstract":"In this paper we present an extension of a method described by Knockaert and De Zutter [4] which leads to rather compact models for electromagnetic simulation results. In addition, a method is presented to represent the compact model as an equivalent circuit which can be used to model e.g. Interconnect structures in a circuit simulator. An example of the use of the extended SVD-Laguerre algorithm and the filter representation is given","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"134 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116338757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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