On the Modeling of Packages from Their Time Responses

F. Canavero, S. Grivet-Talocia, H. Kruger, I. Maio, I. Stievano, P. Thoma
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Abstract

We address the modeling of packages by the estimation of their poles from time responses. Such an approach is suitable for structures with many terminals and can produce low-order very accurate models. A real-world modeling example is used for illustration. Nowadays, macromodels describing the components of mod- ern interconnection systems and enabling their simulation by means of standard circuit simulators are attracting growing in- terest. The macromodeling approach, in fact, offers both high efficiency and accuracy. It splits the simulation problem into two separate stages: higher order effects taking place inside components are handled during the development of macromod- els; the system behavior is then obtained by simulating an elec- trical network of reduced complexity that reproduces the behav- ior of the original components. In this paper, we deal with the development of macromod- els for linear packages from their measured or simulated (e.g., via a fullwave solver) responses. From a formal point of view,
从时间响应看包裹建模
我们通过从时间响应估计它们的极点来解决包的建模问题。这种方法适用于具有许多终端的结构,可以得到低阶的非常精确的模型。使用一个真实世界的建模示例进行说明。目前,描述现代互连系统的组成部分并使其能够通过标准电路模拟器进行仿真的宏观模型正引起人们越来越多的兴趣。事实上,宏建模方法提供了高效率和准确性。它将仿真问题分为两个独立的阶段:在开发宏模型时处理组件内部发生的高阶效应;系统的行为,然后通过模拟一个降低复杂性的电气网络,再现了原始组件的行为。在本文中,我们从测量或模拟的(例如,通过全波求解器)响应中处理线性封装的宏观模型的开发。从正式的角度来看,
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