Organic Chip Packaging Technology For High Speed Processor Applications

Abstract

The high dense interconnect (HDI) organic chip packaging technology has made rapid development advancements in the last few years. Due to the high dense wiring structures in the build up layers and newly also in the laminated core, high signal I/O applications and dense chip area array footprints can be supported. In the present paper the electrical characteristics of the HDI organic chip packaging technology are described with regard to signal and power integrity. In addition different applications for single-chip and multi-chip modules are discussed