参考平面槽附近通孔位置对信号完整性的改善

Tae-Jin Lee, Junho Kim, Hyungsoo Kim, Piljung Jun, Joungho Kim
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引用次数: 6

摘要

信号完整性(SI)受通孔在槽附近位置的影响。在多平面层电路中,当信号走线换层通孔时,信号走线下方的参考平面中是否存在缝隙会影响信号的完整性。通过仿真和测量,可以看出通过在插槽附近设置通孔对信号完整性(SI)的提高效率。当通过插槽放置通孔时,也显示了插槽效率的降低,以提供噪声源与PCB其余部分的隔离。最后讨论了最近参考平面槽附近通孔位置的设计原则。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Improvement of Signal Integrity (SI) according to The Location of Via in The Vicinity of A Slot in The Reference Plane
Signal integrity (SI) is affected by the location of via in the vicinity of slot. In multiple planar layer circuitry, when a signal trace changes layer through via, whether there is a slot in the reference plane beneath the signal trace or not has effects on signal integrity (SI). In this paper, the improved efficiency on signal integrity (SI) according to the location of via in the vicinity of slot is seen through simulation and measurement. The reduction of slot efficiency to provide isolation of a noise source from the rest of the PCB is also shown when a via is placed through the slot. Finally, design rule for the location of via in the vicinity of slot in the nearest reference plane is also discussed.
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