Unit-Cell Modeling of High-Speed Interconnect with Adjacent Metal-Filled Via Array using FDTD method

Abstract

The periodic structure modeling technique is employed to investigate the transmission line characteristic of the stripline with adjacent metal-filled via-array (SAMVA). The unit-cell modeling (UCM) using the finite-difference time-domain (FDTD) method was utilized to determine the full-wave effect on the propagation property of the high speed interconnecting structure defined by longitudinally periodic boundary condition in package and board level. UCM is the efficient modeling methodology for the periodic transmission line structure. Specifically, the slow wave effect of SAMVA will be discussed.