{"title":"基于FDTD的相邻金属填充过孔阵列高速互连单元格建模","authors":"Heeseok Lee, C. Park, D. Kam, Joungho Kim","doi":"10.1109/SPI.2002.258271","DOIUrl":null,"url":null,"abstract":"The periodic structure modeling technique is employed to investigate the transmission line characteristic of the stripline with adjacent metal-filled via-array (SAMVA). The unit-cell modeling (UCM) using the finite-difference time-domain (FDTD) method was utilized to determine the full-wave effect on the propagation property of the high speed interconnecting structure defined by longitudinally periodic boundary condition in package and board level. UCM is the efficient modeling methodology for the periodic transmission line structure. Specifically, the slow wave effect of SAMVA will be discussed.","PeriodicalId":290013,"journal":{"name":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Unit-Cell Modeling of High-Speed Interconnect with Adjacent Metal-Filled Via Array using FDTD method\",\"authors\":\"Heeseok Lee, C. Park, D. Kam, Joungho Kim\",\"doi\":\"10.1109/SPI.2002.258271\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The periodic structure modeling technique is employed to investigate the transmission line characteristic of the stripline with adjacent metal-filled via-array (SAMVA). The unit-cell modeling (UCM) using the finite-difference time-domain (FDTD) method was utilized to determine the full-wave effect on the propagation property of the high speed interconnecting structure defined by longitudinally periodic boundary condition in package and board level. UCM is the efficient modeling methodology for the periodic transmission line structure. Specifically, the slow wave effect of SAMVA will be discussed.\",\"PeriodicalId\":290013,\"journal\":{\"name\":\"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-05-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2002.258271\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2002.258271","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Unit-Cell Modeling of High-Speed Interconnect with Adjacent Metal-Filled Via Array using FDTD method
The periodic structure modeling technique is employed to investigate the transmission line characteristic of the stripline with adjacent metal-filled via-array (SAMVA). The unit-cell modeling (UCM) using the finite-difference time-domain (FDTD) method was utilized to determine the full-wave effect on the propagation property of the high speed interconnecting structure defined by longitudinally periodic boundary condition in package and board level. UCM is the efficient modeling methodology for the periodic transmission line structure. Specifically, the slow wave effect of SAMVA will be discussed.
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