Simulation and Measurement of Interconnect Structures for High Speed Digital Systems

Abstract

Results of electromagnetic simulations and measurements of simple interconnect structure are discussed in this paper. The presented structure was realised on LTCC multilayer board which are suitable for manufacturing of multichip modules for next generation communication systems with clock rates in the 10-100 GHz range. From the presented results it is possible to obtain an impression about distortion of high speed digital signals after passing this or similar interconnect structures. Precision microwave measurement techniques that are important for verification of such simulations are discussed, too.