Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)最新文献_第3页

Novel manufacturing technology for microelectronic packaging fabrication 微电子封装制造新技术

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346838

Y. Yau, M. Sarfaraz, N. S. Sandhu

引用次数: 1

Optical interconnects at the multi-chip module level; a view from the system level 多芯片模块级的光互连;来自系统级别的视图

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346773

D. H. Hartman

引用次数: 3

Reliability and thermal characterization of a 3-dimensional multichip module 三维多芯片模块的可靠性和热特性

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346851

A.W. Lin, A. Lyons, P. Simpkins

引用次数: 3

Component reliability problems: their origins and manifestations 部件可靠性问题:它们的起源和表现

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346846

H. Chan

引用次数: 4

Reliability of 0.4 mm pitch, 256-pin plastic quad flat pack no-clean and water-clean solder joints 0.4毫米间距，256针塑料四平面封装无清洁和水清洁焊点的可靠性

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346854

J. Lau, Y. Pao, C. Larner, R. Govila, S. Twerefour, D. Gilbert, S. Erasmus, S. Dolot

引用次数: 7

A CPU chip-on-board module CPU芯片板载模块

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346859

K. Yamada, A. Tanaka, H. Shinohara, M. Honda, T. Hatada, A. Yamagiwa, Y. Shirai

引用次数: 3

Flip-chip on FR-4 integrated circuit packaging 倒装芯片上的FR-4集成电路封装

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346722

D. Powell, A. K. Trivedi

{"title":"Flip-chip on FR-4 integrated circuit packaging","authors":"D. Powell, A. K. Trivedi","doi":"10.1109/ECTC.1993.346722","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346722","url":null,"abstract":"Technology advances have made it possible to extend the IBM C4 (Controlled Collapse Chip Connection) IC attachment method, also known as flip-chip, to printed circuit boards with low-cost dielectrics, such as FR-4. This new technology is referred to as Flip Chip Attach (FCA). In the past, C4 attachment had been limited to ceramic substrates due to the high temperature (360/spl deg/C) required to renew the low tin solder on the chips, and the need for the substrate to have its thermal expansion relatively closely matched to that of the silicon chip. The development of methods to deposit uniform, small (approximately 1/spl times/10/sup -3/ mm/sup 3/) volumes of eutectic tin/lead solder on printed circuit cards has allowed C4 bumped chips to be reflow soldered to the cards using standard SMT joining time/temperature profiles. The high melt (3-5% tin, balance lead) solder bump on the chip is used simply as a solder wettable device lead in this case. The resulting solder joint is not a true controlled collapse joint, but the process still maintains the self-aligning characteristic of C4, due to the surface tension of the molten eutectic solder and the low mass of the chip. The other enabling technology development for FCA is the use of a controlled expansion epoxy encapsulant between the chip and the substrate to minimize the cyclic strain on the solder joints induced by thermal expansion mismatch between the silicon chip and the FR-4 card. Without the use of such an encapsulant, the thermal cycle fatigue life of the FCA joints would be totally unacceptable, and the technology would be useless. In this paper we will explain how the enabling technologies work to make FCA a viable packaging method, and present reliability data for several different chips using FCA packaging.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"171 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121714130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 47

The use of silver and silver plus gold conductors with the ferro low temperature tape 采用银和银加金导体带的铁低温胶带

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346747

J. H. Alexander, A. Shaikh

引用次数: 1

AlO bonding: a method of joining oxide optical components to aluminum coated substrates 氧化铝粘合:一种将氧化光学元件连接到镀铝基板上的方法

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346803

A. Coucoulas, A. Benzoni, M. F. Dautartas, R. Dutta, W. Holland, C. Nijander, R. Woods

{"title":"AlO bonding: a method of joining oxide optical components to aluminum coated substrates","authors":"A. Coucoulas, A. Benzoni, M. F. Dautartas, R. Dutta, W. Holland, C. Nijander, R. Woods","doi":"10.1109/ECTC.1993.346803","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346803","url":null,"abstract":"With the increased use of photonic packages, there are needs for reliable and low cost methods of attaching optical components. Packages based on silicon optical bench (SiOB) technology include oxide coated ball-lenses and silica fibers which are generally epoxied in anisotropically etched features of silicon substrates. The reliable attachment of these micro-optical components requires the application of small (approximately 1 nanoliter) quantities of epoxy at precise locations on the substrate. This is a time consuming process and requires considerable operator training and skill. Dispensing too much epoxy can deteriorate the optical performance of the device and dispensing too little results in an insufficient holding power. AlO bonding is an alternative attachment technique, under development, which forms solid-state bonds directly between these oxide-components and aluminum thin film coated silicon optical bench substrates and therefore does not require the handling of additives, such as epoxy, at the bond interface. This paper includes: methods of bonding ball-lenses and fibers; an interfacial analysis and proposed bonding mechanism derived from SEM/metallographic photomicrographs and thermodynamic data; destructive test results as a function of bonding and material parameters and; in situ loss measurements through AlO bonded components (multi-, single mode fibers and ball-lenses) during the bonding procedures and subsequent thermal cycling (-40 to 80/spl deg/C and from ambient to -195.8/spl deg/C) tests.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122959773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

High K thick film and tape material 高K厚薄膜和胶带材料

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346748

D.H. Dychala, P. Bless, R.L. Wahlers, S. Stein

引用次数: 0