多芯片模块级的光互连;来自系统级别的视图

D. H. Hartman
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引用次数: 3

摘要

对于光互连技术人员来说,存在着在多芯片模块(MCM)级别实现光替代方案的愿景。以其最基本的形式表达,愿景是在计算机终端上设计MCM,其中设计者有10层或更多层可用的金属互连层,可能还有2层,称为“光电”层(opto1, opto2)。光电层由一些电子兼容的介电层组成,这些介电层可以在多层MCM结构中放置和图图化以形成非常低损耗的光波导。这些波导和相关的驱动器/接收器电子器件具有足够优越的光学性能特征和足够强大的机械/热性能,在MCM级别实现它们相当于为布局工程师直接描述设计规则。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optical interconnects at the multi-chip module level; a view from the system level
To the optical interconnect technologist, there exists a vision of implementation of the optical alternative at the multi-chip module (MCM) level. Expressed in its most basic form, the vision is that of a MCM being designed at a computer terminal wherein the designer has 10 or more layers of metal interconnect levels available,and perhaps 2 other layers, referred to as "opto" layers (optol, opto2). The opto layers consist of some electronically compatible dielectric layer that can be laid down and patterned to form very low-loss optical waveguides within the multi-layer MCM structure. These waveguides, and the associated driver/receiver electronics, have sufficiently superior optical performance characteristics and sufficiently robust mechanical/thermal properties that implementing them at the MCM level amounts to straightforward delineation of design rules for the layout engineer.<>
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