{"title":"多芯片模块级的光互连;来自系统级别的视图","authors":"D. H. Hartman","doi":"10.1109/ECTC.1993.346773","DOIUrl":null,"url":null,"abstract":"To the optical interconnect technologist, there exists a vision of implementation of the optical alternative at the multi-chip module (MCM) level. Expressed in its most basic form, the vision is that of a MCM being designed at a computer terminal wherein the designer has 10 or more layers of metal interconnect levels available,and perhaps 2 other layers, referred to as \"opto\" layers (optol, opto2). The opto layers consist of some electronically compatible dielectric layer that can be laid down and patterned to form very low-loss optical waveguides within the multi-layer MCM structure. These waveguides, and the associated driver/receiver electronics, have sufficiently superior optical performance characteristics and sufficiently robust mechanical/thermal properties that implementing them at the MCM level amounts to straightforward delineation of design rules for the layout engineer.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Optical interconnects at the multi-chip module level; a view from the system level\",\"authors\":\"D. H. Hartman\",\"doi\":\"10.1109/ECTC.1993.346773\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To the optical interconnect technologist, there exists a vision of implementation of the optical alternative at the multi-chip module (MCM) level. Expressed in its most basic form, the vision is that of a MCM being designed at a computer terminal wherein the designer has 10 or more layers of metal interconnect levels available,and perhaps 2 other layers, referred to as \\\"opto\\\" layers (optol, opto2). The opto layers consist of some electronically compatible dielectric layer that can be laid down and patterned to form very low-loss optical waveguides within the multi-layer MCM structure. These waveguides, and the associated driver/receiver electronics, have sufficiently superior optical performance characteristics and sufficiently robust mechanical/thermal properties that implementing them at the MCM level amounts to straightforward delineation of design rules for the layout engineer.<<ETX>>\",\"PeriodicalId\":281423,\"journal\":{\"name\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1993.346773\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346773","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optical interconnects at the multi-chip module level; a view from the system level
To the optical interconnect technologist, there exists a vision of implementation of the optical alternative at the multi-chip module (MCM) level. Expressed in its most basic form, the vision is that of a MCM being designed at a computer terminal wherein the designer has 10 or more layers of metal interconnect levels available,and perhaps 2 other layers, referred to as "opto" layers (optol, opto2). The opto layers consist of some electronically compatible dielectric layer that can be laid down and patterned to form very low-loss optical waveguides within the multi-layer MCM structure. These waveguides, and the associated driver/receiver electronics, have sufficiently superior optical performance characteristics and sufficiently robust mechanical/thermal properties that implementing them at the MCM level amounts to straightforward delineation of design rules for the layout engineer.<>