发布求助
文献互助 智能选刊 最新文献

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)最新文献

筛选
英文 中文
CSTAR database for advanced test systems CSTAR数据库用于先进的测试系统
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346837
C. Hunter, R. B. Southard
{"title":"CSTAR database for advanced test systems","authors":"C. Hunter, R. B. Southard","doi":"10.1109/ECTC.1993.346837","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346837","url":null,"abstract":"The CSTAR (cards status tracking recording) database tracks inventory redesign/failure history of the field replaceable units (cards and components) that make up the VLSI device advanced test systems (ATS) that have been designed and manufactured at IBM, East Fishkill. CSTAR obsoletes the process of logging hardware failures in a notebook where inventory and failure-to-repair actions can not be easily identified. CSTAR provides an automatic serial number generator facility for new card tracking, status histories of all cards, SQL reports for analyzing failure histories for the most frequently used repair process, engineering change summaries per card, and a comprehensive user's guide (on-line and hard copy.) CSTAR runs in a distributed environment with LANs providing the link to a centralized database enabling all information to be immediately available to all authorized users in the laboratory and manufacturing test areas. Since repair attempts now have a consistent approach, second and third shift problem take over is accelerated and simplified, and hardware maintenance programs are forecasted, there is enhanced equipment reliability by reduced unplanned maintenance and quicker turn around time.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115362333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Palladium-catalyzed sintering of molybdenum paste applied to multilayer substrate fabrication 钯催化烧结钼膏在多层衬底制造中的应用
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346791
A. Kumar
{"title":"Palladium-catalyzed sintering of molybdenum paste applied to multilayer substrate fabrication","authors":"A. Kumar","doi":"10.1109/ECTC.1993.346791","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346791","url":null,"abstract":"This paper describes a novel method for densifying the surfaces of external, thick film molybdenum circuit features of multilayer ceramic substrates using palladium as a sintering catalyst. Such dense sintering of the surface effectively prevents the formation of undesirable pools of glass on the surfaces of the external features, making it possible to perform contact-probe electrical testing prior to plating and to nickel plate the molybdenum features without the customary cleaning steps needed to clear the pools of glass.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121001545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
New metal board for COB, Multi-Chip Module, TAB and Phlip-Chip 新型金属板，适用于COB，多芯片模块，标签和倒装芯片
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346790
A. Okuno, N. Oyama, T. Hashimoto, H. Kinoshita, H. Shida
{"title":"New metal board for COB, Multi-Chip Module, TAB and Phlip-Chip","authors":"A. Okuno, N. Oyama, T. Hashimoto, H. Kinoshita, H. Shida","doi":"10.1109/ECTC.1993.346790","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346790","url":null,"abstract":"Recently, the use of high-density mounting and multi-function design have been rapidly progressing on the industry. For metal board, the chip on board (COB) method has been widely employed with which a silicon chip is directly connected to a metal board by use of the wire bonding method. However, conventional metal boards are insufficient with respect to reliability. We have succeeded in the development of metal board having a high reliability by using a compound material high-purity, of a high-function naphthalene epoxy resin and an aramid paper from PPODTA (Co-poly-paraphenylene 3,4-oxydiphenylene terephthalamide) for its insulating layer which is the most important part with respect to reliability. The metal board is excellent in heat resistance and heat dissipation, and particularly in migration resistance. Its coefficient of linear expansion is 6 ppm board can be expected to be applied for advanced surface mounting technologies, such as LCCC, COB, Flip Chip, PGA, MCM (Multi Chip Module) and TAB. These applications are automobiles, air conditioners, air craft, space satellite, rocket and small-sized motors.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"190 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126037790","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Investigation of plasma effects on plastic packages delamination and cracking 等离子体对塑料包装分层和开裂影响的研究
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346821
F. Djennas, E. Prack, Y. Matsuda
{"title":"Investigation of plasma effects on plastic packages delamination and cracking","authors":"F. Djennas, E. Prack, Y. Matsuda","doi":"10.1109/ECTC.1993.346821","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346821","url":null,"abstract":"This paper investigates the use of a non-reactive plasma formed in a radio frequency discharge as a treatment to various substrates to reduce or eliminate the organic and inorganic contamination which prevents intimate interfacial contact. Argon was investigated as the plasma gas. The effect of time, chamber pressure, and power were studied. A goniometer was utilized to measure wetting contact angles as a quantitative measure of the cleaning effectiveness of the surface treatment. ESCA (electron spectroscopy for chemical analysis) data are correlated to substrate hydrophilicity, delamination and package cracking. The results show the argon plasma treatment to be an effective mean of reducing interfacial organic and inorganic contamination and improving the polyimide to mold compound adhesion. The improvement in package cracking performance brought about the argon plasma treatment is significant.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129706391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
Structural optimization of an electrical spring contact 电弹簧触点的结构优化
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346693
T. Macek, J. Pitarresi
{"title":"Structural optimization of an electrical spring contact","authors":"T. Macek, J. Pitarresi","doi":"10.1109/ECTC.1993.346693","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346693","url":null,"abstract":"A fundamental technology employed in some area array connector designs is an electrically conductive spring contact that delivers a contact force when deflected. The structural design optimization analysis of a typical spring contact exhibiting such mechanical behavior is discussed with emphasis on the development of a methodology for acquiring the analytical equations necessary for optimizing the design. This includes equations that govern the spring response (deflections, stresses) due to applied loads and equations that define the objective function (function being optimized) and design constraints (limits imposed on the design) in terms of the design parameters. A performance comparison of two computer programs used to optimize a specific spring contact design is presented. One of the programs was written in C programming language and is based on the development of the analytical equations discussed above. The other program is an ANSYS batch program. Results comparing various measures of performance are presented, including computational efficiency, accuracy, starting point sensitivity, and total execution time.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128691153","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Temperature-dependent material characterizations for thin epoxy FR-4/ E-Glass woven laminate 薄环氧FR-4/ E-Glass编织层压板的温度依赖材料特性
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346789
C. Fu, R. Brown, C. Ume
{"title":"Temperature-dependent material characterizations for thin epoxy FR-4/ E-Glass woven laminate","authors":"C. Fu, R. Brown, C. Ume","doi":"10.1109/ECTC.1993.346789","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346789","url":null,"abstract":"A rapid and flexible material characterization system is presented. With this computerized testing module, thermally expansional and monotonic tests have been conducted to determine the elastic behavior of thin epoxy FR-4/ E-Glass woven laminates under different temperature levels. In this research the electrical resistance strain gauge technique is used to evaluate the test methods for different material properties. This includes two main steps for each temperature level. First is to test thermal expansions under stress-free conditions and then to test linear elastic constants in two dimensional cases. The thin laminates are assumed to be linear and orthogonal. The temperature-dependent properties of interest are coefficients of thermal expansion (CTEs), Young's moduli, shear moduli, and Poisson's ratio. The temperature levels ranged between 23/spl deg/C and 150/spl deg/C, which is higher than the glass transition temperature (T/sub g/), 125/spl deg/C, of the tested material. The setup, the features and the capabilities of the automated material testing system are also discussed.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130357143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Analyses of strips metallization effect on the delay time of integrated circuit elements 带状金属化对集成电路元件延迟时间的影响分析
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346706
H. Bourdoucen, A. Issaoun, M. Djeddi
{"title":"Analyses of strips metallization effect on the delay time of integrated circuit elements","authors":"H. Bourdoucen, A. Issaoun, M. Djeddi","doi":"10.1109/ECTC.1993.346706","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346706","url":null,"abstract":"The quasi-static parameters of planar lossless multiconductor transmission line systems are computed using the semianalytical method of lines with nonequidistant discretization. The effect of metallization thickness on the capacitance and inductance matrices of one, two, and five strips in a two-layer dielectric medium is taken into account. The propagation delay which is related to the inductance and capacitance matrices of these structures is considerably affected by the metallization thickness of the conductor strips. The relative variations of this time delay with respect to zero thickness approximation time delay for the structures studied reach about 20% for t/w of 30%.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130635622","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
AC design issues for a multireference computer package 多参考计算机封装的交流设计问题
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346725
B. McCredle, H. Blennemann
{"title":"AC design issues for a multireference computer package","authors":"B. McCredle, H. Blennemann","doi":"10.1109/ECTC.1993.346725","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346725","url":null,"abstract":"A potentially harmful form of ground bounce that takes place at board connector locations is described, modeled, and experimentally demonstrated. Ground bounce was successfully measured in a laboratory environment, on TCM boards detached from the mainframe. The laboratory analysis shows that the amplitude of the ground bounce can be reduced six-fold by increasing the number of reference planes. The risk of false triggering was greatly reduced for the TCM boards with additional reference planes. First-order theoretical modeling of ground bounce approximates the noise waveforms seen on the disturbed lines.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123921730","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Finite element analysis of printing wiring board due to the solder masking process warpage 印刷线路板因焊料遮蔽过程翘曲的有限元分析
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346711
T. Martin, C. Ume
{"title":"Finite element analysis of printing wiring board due to the solder masking process warpage","authors":"T. Martin, C. Ume","doi":"10.1109/ECTC.1993.346711","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346711","url":null,"abstract":"Efforts have been made to look at the various processes a printed wiring board (PWB) undergoes during its production, such as lamination, solder masking, and soldering, to determine their impact on board warpage. The focus of this research is on the influence of solder masking process on the PWB warpage. Finite element techniques were used to examine two areas related to solder mask and its application process. The first area studied was sensitivity of board warpage to changes in the mask material properties. The second area studied involved two steps used in applying the mask to the PWBs: curtain coating and curing. Results of these analyses have resulted in general guidelines that should be observed when selecting a mask material and application method.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121382644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High density area array module connector 高密度区域阵列模块连接器
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346809
F.W. Chapin, J.J. Kershaw, A. Knight
{"title":"High density area array module connector","authors":"F.W. Chapin, J.J. Kershaw, A. Knight","doi":"10.1109/ECTC.1993.346809","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346809","url":null,"abstract":"The increase in circuits per module chip has also increased the demand for the quantity of contacts per module. Ideally, this increase should be accomplished by an increase in contact density and not an expansion in module size. Furthermore, the ever-increasing shift from single chip to multiple chip modules is accomplished by a shift from permanently attached to plugable modules. This paper describes a newly developed module-to-card array connector that uses a unique contact system which provides high density, and high reliability at an affordable cost. Connector and contact design details, as well as theoretical and actual test data, are presented.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121654791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信