High density area array module connector

Abstract

The increase in circuits per module chip has also increased the demand for the quantity of contacts per module. Ideally, this increase should be accomplished by an increase in contact density and not an expansion in module size. Furthermore, the ever-increasing shift from single chip to multiple chip modules is accomplished by a shift from permanently attached to plugable modules. This paper describes a newly developed module-to-card array connector that uses a unique contact system which provides high density, and high reliability at an affordable cost. Connector and contact design details, as well as theoretical and actual test data, are presented.<>