New metal board for COB, Multi-Chip Module, TAB and Phlip-Chip

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346790

A. Okuno, N. Oyama, T. Hashimoto, H. Kinoshita, H. Shida

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引用次数: 1

Abstract

Recently, the use of high-density mounting and multi-function design have been rapidly progressing on the industry. For metal board, the chip on board (COB) method has been widely employed with which a silicon chip is directly connected to a metal board by use of the wire bonding method. However, conventional metal boards are insufficient with respect to reliability. We have succeeded in the development of metal board having a high reliability by using a compound material high-purity, of a high-function naphthalene epoxy resin and an aramid paper from PPODTA (Co-poly-paraphenylene 3,4-oxydiphenylene terephthalamide) for its insulating layer which is the most important part with respect to reliability. The metal board is excellent in heat resistance and heat dissipation, and particularly in migration resistance. Its coefficient of linear expansion is 6 ppm board can be expected to be applied for advanced surface mounting technologies, such as LCCC, COB, Flip Chip, PGA, MCM (Multi Chip Module) and TAB. These applications are automobiles, air conditioners, air craft, space satellite, rocket and small-sized motors.<>

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新型金属板，适用于COB，多芯片模块，标签和倒装芯片

近年来，高密度安装和多功能设计的使用在工业上得到了迅速的发展。对于金属板，目前广泛采用的是板上芯片(COB)方法，即用线接法将硅芯片直接连接到金属板上。然而，传统的金属板在可靠性方面是不够的。我们已经成功地开发了具有高可靠性的金属板，使用高纯度的复合材料，高性能的萘环氧树脂和芳纶纸从ppadta(共聚对苯二烯3,4-氧二苯基对苯二甲酰胺)，其绝缘层是最重要的部分。金属板具有优良的耐热性和散热性，尤其是耐迁移性。其线性膨胀系数为6ppm，有望应用于先进的表面贴装技术，如LCCC、COB、Flip Chip、PGA、MCM(多芯片模块)和TAB。这些应用包括汽车、空调、飞机、太空卫星、火箭和小型发动机。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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