Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)最新文献_第10页

Fiber-optic interconnect and component packaging for the next generation of aerospace platforms 下一代航空航天平台的光纤互连和组件封装

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346735

R. Uhlhorn

引用次数: 13

Study of soldering for VLSI/FLC spatial light modulators VLSI/FLC空间光调制器的焊接研究

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346800

Wei Lin, Y. Lee, K. Johnson

{"title":"Study of soldering for VLSI/FLC spatial light modulators","authors":"Wei Lin, Y. Lee, K. Johnson","doi":"10.1109/ECTC.1993.346800","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346800","url":null,"abstract":"Spatial light modulators (SLM) using ferroelectric liquid crystal over a very large scale integrated circuit (VLSI/FLC) are critical elements to high-definition displays, pattern correlation, and many other optoelectronic processing systems. A self-aligning soldering technology is being developed to package these high-performance modulators cost-effectively. It needs to achieve a uniform, /spl mu/m-level gap for FLC, and align the glass, the VLSI, and the substrate with an accuracy of 10 /spl mu/m. Two studies have been conducted to assist the technology development. The first designs the solder joints for the assembly. By modeling, 0.4 mm/sup 3/ is chosen for the volume of the large solder joints (1000 /spl mu/m in diameter) that would produce the maximum force pulling the glass against the VLSI for the gap control. Also, 11.4/spl times/10/sup 6/ /spl mu/m/sup 3/ is chosen for the volume of the medium solder joints (500 /spl mu/m in diameter) under the VLSI for low-cost self-alignments. The second study develops a fluxless soldering process with the measurements of the surface tension coefficients w.r.t. different reflow parameters. The optimum parameters are 280/spl deg/C of the hot paddle and 2.5 liter/min flow rate of the forming gas. The achieved surface tension coefficient is abound 280 dyne/cm that assures the quality of the developed soldering is as good as that of the soldering using flux. A glass/silicon test vehicle is soldered with the optimum parameters. The range of its gap thicknesses measured over the entire area is from 1.7 to 2.6 /spl mu/m. The developed soldering technology achieves the required /spl mu/m-level gap with sub-/spl mu/m uniformity.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132223261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Processing and properties of silicon-carbon liquid encapsulants 硅碳液体封装剂的制备及性能研究

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346766

J. K. Bard, R. Brady, J. Schwark

{"title":"Processing and properties of silicon-carbon liquid encapsulants","authors":"J. K. Bard, R. Brady, J. Schwark","doi":"10.1109/ECTC.1993.346766","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346766","url":null,"abstract":"In 1992, SYCAR resin, a new silicon-carbon thermosetting resin, was introduced to the electronics industry. Characteristics of the resin include excellent moisture resistance, ionic purity, low dielectric constant, and good-thermal properties. This combination of properties makes the resin particularly suited for encapsulant applications. In this paper, the processing and properties of silicon-carbon liquid encapsulants are presented in detail. Production of quality parts requires the use of proper dispensing and cure conditions. The rheology of the silicon-carbon liquid encapsulant as a function of filler level, shear, time, and temperature has been characterized as a guide in selecting proper processing conditions. The development of properties during cure for a range of cure temperatures has been studied to provide recommendations for curing conditions. In addition, the shelf life of the liquid encapsulants has been monitored at temperatures of -20/spl deg/C to ambient temperature over six months. The impact of these results on the processing, curing, and storage of SYCAR resin encapsulant is presented.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"357 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131474684","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Electroless Cu plated AlN substrate 化学镀铜AlN衬底

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346700

B. Chiou, J. Chang

引用次数: 0

Plastic optical connectors molded directly onto optical fibers and optical fiber ribbons 直接模制在光纤和光纤带上的塑料光连接器

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346799

M. Robertsson, P. Eriksen, B. Lindstrom, Hans-Christer Moll, Jan-Aake Engstrand

引用次数: 7

Optoelectronic interconnects using microlens arrays formed in glass 光电互连使用在玻璃中形成的微透镜阵列

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346734

N. Borrelli

引用次数: 1

RwoH integral package for MCM using the GE HDI process with a metal barrier RwoH集成封装MCM采用GE HDI工艺与金属屏障

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346739

J. Burgess, C. Neugebauer

引用次数: 1

Effects of mechanical and flow properties of encapsulating resin on the performance of ultra thin tape carrier package 包封树脂的力学性能和流动性能对超薄胶带载体包装性能的影响

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346813

Y. Nakamura, M. Ohta, T. Nishioka, A. Tanaka, S.-i. Ohizumi, H. Tabata, M. Kohmoto

引用次数: 3

Thermosonic bonding: an alternative to area-array solder connections 热声键合:区域阵列焊料连接的替代方案

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346749

S. Kang, T. Ju, Y.C. Lee

{"title":"Thermosonic bonding: an alternative to area-array solder connections","authors":"S. Kang, T. Ju, Y.C. Lee","doi":"10.1109/ECTC.1993.346749","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346749","url":null,"abstract":"Thermosonic bondings for flip-chip, TAB, or surface mount technologies are potential alternatives to solder connections. They are dry processes having low-cost, simplicity, and fine-pitch advantages. The applications of these new connection technologies are expected to grow if their two major problems, assembly yield and reliability, are solved. The assembly problem is studied in this paper. It is well known that the use of ultrasonic energy can significantly simplify metal bonding processes. However, the changes of thermosonic process windows for area-array connections are not controllable; the progress of this technology development is not encouraging. Using flip-chip bonding cases with 30- and 1000-I/O chips, this work studies the effects on yields from tool configurations and masses. The yield is closely related to the ultrasonic amplitude of metal bumps. The amplitude associated with a good bonding process for a 30-I/O chip is about 1.30 /spl mu/m. However, it could be reduced to 0.26 /spl mu/m when the die collet is enlarged for a 1000-I/O chip. Fortunately, such a reduction can be overcome by a design that changes the mass of the collet and the length of the shank. This paper will address the understanding and the control of these effects with experimental and modeling studies.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115840287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Field reliability enhancement of electronic modules using ESS 利用ESS提高电子模块的现场可靠性

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346847

K.P. Stone, M. Goldenberg, R. Munikoti

引用次数: 0