{"title":"下一代航空航天平台的光纤互连和组件封装","authors":"R. Uhlhorn","doi":"10.1109/ECTC.1993.346735","DOIUrl":null,"url":null,"abstract":"The author first presents an overview of the requirements for data communication subsystems in modern, high-performance military aircraft and spacecraft, in order to put a perspective on the issues and challenges. The evolution of the needed fiber-optic components such as transmitters, receivers, and interconnection hardware is presented. This leads to a description of the state of the art in aerospace optoelectronic packaging, as it is practised at the Harris Corporation. The author concludes with a list of promising optical and optoelectronic technologies expected to be found in future avionic subsystems.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Fiber-optic interconnect and component packaging for the next generation of aerospace platforms\",\"authors\":\"R. Uhlhorn\",\"doi\":\"10.1109/ECTC.1993.346735\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The author first presents an overview of the requirements for data communication subsystems in modern, high-performance military aircraft and spacecraft, in order to put a perspective on the issues and challenges. The evolution of the needed fiber-optic components such as transmitters, receivers, and interconnection hardware is presented. This leads to a description of the state of the art in aerospace optoelectronic packaging, as it is practised at the Harris Corporation. The author concludes with a list of promising optical and optoelectronic technologies expected to be found in future avionic subsystems.<<ETX>>\",\"PeriodicalId\":281423,\"journal\":{\"name\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"volume\":\"72 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1993.346735\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346735","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fiber-optic interconnect and component packaging for the next generation of aerospace platforms
The author first presents an overview of the requirements for data communication subsystems in modern, high-performance military aircraft and spacecraft, in order to put a perspective on the issues and challenges. The evolution of the needed fiber-optic components such as transmitters, receivers, and interconnection hardware is presented. This leads to a description of the state of the art in aerospace optoelectronic packaging, as it is practised at the Harris Corporation. The author concludes with a list of promising optical and optoelectronic technologies expected to be found in future avionic subsystems.<>