Processing and properties of silicon-carbon liquid encapsulants

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346766

J. K. Bard, R. Brady, J. Schwark

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引用次数: 1

Abstract

In 1992, SYCAR resin, a new silicon-carbon thermosetting resin, was introduced to the electronics industry. Characteristics of the resin include excellent moisture resistance, ionic purity, low dielectric constant, and good-thermal properties. This combination of properties makes the resin particularly suited for encapsulant applications. In this paper, the processing and properties of silicon-carbon liquid encapsulants are presented in detail. Production of quality parts requires the use of proper dispensing and cure conditions. The rheology of the silicon-carbon liquid encapsulant as a function of filler level, shear, time, and temperature has been characterized as a guide in selecting proper processing conditions. The development of properties during cure for a range of cure temperatures has been studied to provide recommendations for curing conditions. In addition, the shelf life of the liquid encapsulants has been monitored at temperatures of -20/spl deg/C to ambient temperature over six months. The impact of these results on the processing, curing, and storage of SYCAR resin encapsulant is presented.<>

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硅碳液体封装剂的制备及性能研究

1992年，SYCAR树脂，一种新型硅碳热固性树脂，被引入电子工业。该树脂的特点包括优异的耐湿性、离子纯度、低介电常数和良好的热性能。这种特性的组合使树脂特别适合于密封剂的应用。本文详细介绍了硅碳液体封装剂的制备工艺和性能。生产优质零件需要使用适当的点胶和固化条件。硅碳液体封装剂的流变性是填料水平、剪切、时间和温度的函数，这是选择适当的加工条件的指导。在一定的固化温度下，研究了固化过程中性能的发展，为固化条件提供了建议。此外，在-20/spl℃至环境温度下，监测了液体密封剂的保质期超过6个月。介绍了这些结果对SYCAR树脂封装剂的加工、固化和贮存的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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