包封树脂的力学性能和流动性能对超薄胶带载体包装性能的影响

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346813

Y. Nakamura, M. Ohta, T. Nishioka, A. Tanaka, S.-i. Ohizumi, H. Tabata, M. Kohmoto

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引用次数: 3

摘要

为满足存储器尺寸更小、更薄的要求，开发了一种新的超薄磁带载体封装(TCP)。封装厚度为0.4 mm，硅片厚度为0.2 mm。为了实现薄封装，需要胶带自动粘接(TAB)技术。Nitto的传递成型技术用于获得与其他表面贴装器件(smd)相同水平的可靠性和传统回流可焊性。硅片的上表面和侧表面用树脂封装，但底面仍然暴露。本文制备了四种填料体积分数不同的环氧封装树脂，获得了不同的力学性能和流动性能。研究了包封树脂的热膨胀系数和粘度对新型超薄封装性能的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effects of mechanical and flow properties of encapsulating resin on the performance of ultra thin tape carrier package

A new ultra thin tape carrier package (TCP) for memory card was developed to meet demands for smaller and thinner TSOP. The thickness of package and Si chip are 0.4 and 0.2 mm, respectively. In order to achieve thin packages, the technology of tape automated bonding (TAB) is required. Nitto's transfer molding technology is used to obtain the same level of both reliability and conventional reflow solderability as those of other surface mount devices (SMDs). The upper and side surface of the Si chip are encapsulated with resin, but the bottom surface is still exposed. In this paper, four kinds of epoxy encapsulating resins with different filler volume fractions were prepared to obtain various mechanical and flow properties. The effects of the coefficient of thermal expansion and viscosity of the encapsulating resin on the performance of the new ultra thin packages are studied.<>

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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