微电子封装制造新技术

Y. Yau, M. Sarfaraz, N. S. Sandhu
{"title":"微电子封装制造新技术","authors":"Y. Yau, M. Sarfaraz, N. S. Sandhu","doi":"10.1109/ECTC.1993.346838","DOIUrl":null,"url":null,"abstract":"Flexible, quick turn around and high density interconnection circuit patterning capabilities are key for packaging manufacturing as the industry grows at an increasingly competitive and faster pace. A novel fabrication technology for multilayer ceramic (MLC) packaging has been investigated and developed to meet these challenges. This flexible technology combines the data-driven high energy, high current electron beam technology with the unique integrated-mask (for thick film) metallization process technology to enable converting the circuit design data to fully metalized ceramic sheets in minutes. Thus, many different designs can be patterned and ready for stacking/lamination in days (i.e. no new punch heads or metallization masks needed). In addition, this technology will significantly reduce product development cycle time when utilized for product design verification and prototype build, significantly. This paper describes the novel packaging manufacturing technology and experimental results.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Novel manufacturing technology for microelectronic packaging fabrication\",\"authors\":\"Y. Yau, M. Sarfaraz, N. S. Sandhu\",\"doi\":\"10.1109/ECTC.1993.346838\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Flexible, quick turn around and high density interconnection circuit patterning capabilities are key for packaging manufacturing as the industry grows at an increasingly competitive and faster pace. A novel fabrication technology for multilayer ceramic (MLC) packaging has been investigated and developed to meet these challenges. This flexible technology combines the data-driven high energy, high current electron beam technology with the unique integrated-mask (for thick film) metallization process technology to enable converting the circuit design data to fully metalized ceramic sheets in minutes. Thus, many different designs can be patterned and ready for stacking/lamination in days (i.e. no new punch heads or metallization masks needed). In addition, this technology will significantly reduce product development cycle time when utilized for product design verification and prototype build, significantly. This paper describes the novel packaging manufacturing technology and experimental results.<<ETX>>\",\"PeriodicalId\":281423,\"journal\":{\"name\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1993.346838\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346838","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

灵活,快速周转和高密度互连电路的能力是关键的封装制造行业的增长在竞争日益激烈和更快的步伐。为了应对这些挑战,研究和开发了一种新的多层陶瓷封装制造技术。这种灵活的技术将数据驱动的高能、大电流电子束技术与独特的集成掩模(用于厚膜)金属化工艺技术相结合,能够在几分钟内将电路设计数据转换为完全金属化的陶瓷片。因此,许多不同的设计可以图案化,并准备在几天内堆叠/层压(即不需要新的冲头或金属化掩模)。此外,当用于产品设计验证和原型构建时,该技术将显著缩短产品开发周期。本文介绍了新型包装制造工艺及实验结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel manufacturing technology for microelectronic packaging fabrication
Flexible, quick turn around and high density interconnection circuit patterning capabilities are key for packaging manufacturing as the industry grows at an increasingly competitive and faster pace. A novel fabrication technology for multilayer ceramic (MLC) packaging has been investigated and developed to meet these challenges. This flexible technology combines the data-driven high energy, high current electron beam technology with the unique integrated-mask (for thick film) metallization process technology to enable converting the circuit design data to fully metalized ceramic sheets in minutes. Thus, many different designs can be patterned and ready for stacking/lamination in days (i.e. no new punch heads or metallization masks needed). In addition, this technology will significantly reduce product development cycle time when utilized for product design verification and prototype build, significantly. This paper describes the novel packaging manufacturing technology and experimental results.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信